Interposer testing using dummy connections

An intermediary, electrical connection technology, applied in the field of interconnect components with dummy components, can solve problems such as cost generation and difficulty in effectively testing interposers

Active Publication Date: 2012-11-28
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Typically, it is difficult to efficiently test interposers because the connections in the interposer are often open connections before the interposer is bonded to other packaged components
Although additional test structures can be formed and attached to the interposer to provide loopbacks, this incurs a cost due to the formation of additional devices with loopback structures

Method used

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  • Interposer testing using dummy connections
  • Interposer testing using dummy connections
  • Interposer testing using dummy connections

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Embodiment Construction

[0037] The making and using of various embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.

[0038] Structures for testing the reliability of interconnection elements and methods of implementing the tests are provided according to embodiments. Then discusses the variation and implementation process of the embodiment. Like reference numerals refer to like parts throughout the various drawings and embodiments.

[0039] figure 1 A cross-sectional view of interconnect element 12 is shown configured to form an electrical connection between major surface 12A and major surface 12B, where major surfaces 12A and 12B are opposing surfaces of interconnect element 12 . I...

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Abstract

An interconnection component includes a substrate, and an active through-substrate via (TSV) penetrating through the substrate. Active metal connections are formed over the substrate and electrically connected to the active TSV. At least one of a dummy pad and a dummy solder bump are formed on surfaces of the interconnection component. The dummy pad is over the substrate and electrically connected to the active TSV and the active metal connections. The dummy solder bump is under the substrate and electrically connected to the active metal connections. The dummy pad and the dummy solder bump are open ended. The invention also provides an interposer testing using the dummy connections.

Description

technical field [0001] The method relates to an interconnection element, in particular an interconnection element with a dummy component. Background technique [0002] In three-dimensional integrated circuits, an interposer is used to bond devices located above it. Interposers are typically passive interposers, wherein no active devices such as transistors are formed in the interposer. Through-substrate vias (TSVs) are used to form electrical connections between one side of the interposer and the opposite side. In addition, there may be a metal wiring layer on one or both sides of the interposer for electrically connecting the solder bumps on the surface of the interposer to the TSVs and for electrically interconnecting the solder bumps. . [0003] Typically, it is difficult to efficiently test an interposer because the connections in the interposer are often open connections before the interposer is bonded to other packaged components. While additional test structures c...

Claims

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Application Information

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IPC IPC(8): H01L23/544
CPCH01L23/49827H01L23/49822H01L2224/13025H01L22/32H01L23/498H01L2224/16H01L22/30Y10T29/49004
Inventor 陆湘台林志贤洪伟硕
Owner TAIWAN SEMICON MFG CO LTD
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