Wafer defect scanning method and wafer defect scanning machine
A defect scanning, wafer technology, applied in the direction of optical testing flaws/defects, etc., can solve problems such as difficult to capture, abnormal fixed point line width, etc., to achieve the effect of improving the ability to capture and strengthen the ability to capture defects
Active Publication Date: 2015-07-29
SHANGHAI HUALI MICROELECTRONICS CORP
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However, when this scanning method is abnormal for the entire wafer, that is, the fifth pixel 105 is compared with the fourth pixel 104 and the sixth pixel 106. At this time, since the unit pixels adjacent to the fifth pixel 105 all Abnormal, there is no difference after comparison, which makes it impossible to define a defect
For example, excessive chemical mechanical polishing of wafers, abnormal fixed point line width, etc., are difficult to capture defects with this method
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[0020] The present invention is described below in conjunction with embodiment.
[0021] figure 2 The relationship between the unit pixel 203 , the wafer 201 and the unit chip 202 mentioned in the embodiment of the present invention is shown.
[0022] like image 3 As shown in the flow chart of the present invention, the steps of the wafer defect scanning method in the embodiment of the present invention include:
[0023] In step 301, the unit pixel with the highest frequency of occurrence at each position on each wafer of a certain station on the assembly line is counted, and the unit pixel with the highest frequency of occurrence is assigned to the corresponding position on the virtual wafer to obtain a virtual perfect wafer And save the virtual perfect wafer; the wafers passing through a certain station on the wafer processing line should have consistent morphological characteristics, so it is meaningful to carry out statistics at the same station, and the morphologies a...
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The invention discloses a method for scanning wafer defects, which comprises the steps of: calculating to obtain the most frequent unit pixels of various positions on various wafers of some station on a production line and applying to corresponding positions on a virtual wafer to obtain a virtual perfect wafer, and storing the virtual perfect wafer; comparing the stored virtual perfect wafer with the wafer of some station on the production line; and detecting defects of the wafer layer. Furthermore, the invention discloses a machine for scanning wafer defects, including the method for scanning wafer defects. According to the scanning method, a defect scanning way of comparing the virtual perfect wafer and the wafer is added, thereby enhancing the ability of the scanning machine to catch the defects.
Description
technical field [0001] The invention relates to the field of semiconductor yield improvement, in particular to a wafer defect scanning method and a wafer defect scanning machine. Background technique [0002] With the development of semiconductor device technology, defect detection has become an indispensable means to improve semiconductor yield. At present, the industry generally uses the method of comparing adjacent unit pixels to capture defects. But there are some defects that will appear on the whole wafer, which are called abnormal defects of the whole wafer. [0003] Today's defect scanning method is by comparing adjacent unit pixels (up and down or left and right). If there is a difference, define the difference as a defect, such as figure 1 After comparing the second unit pixel 102 with the adjacent first unit pixel 101 and the third unit pixel 103 , it can be known that the second unit pixel 102 has a defect. However, when this scanning method is abnormal fo...
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IPC IPC(8): G01N21/88
Inventor 郭贤权许向辉顾珍
Owner SHANGHAI HUALI MICROELECTRONICS CORP