Pressure-sensitive adhesive composition and pressure sensitive adhesive tape

A composition and adhesive technology, applied in the direction of adhesive types, ester copolymer adhesives, graft polymer adhesives, etc., can solve the problems of insufficient temperature-sensitive adhesiveness and other problems

Inactive Publication Date: 2013-04-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, although the adhesive composition reported in Patent Document 1 can exhibit high blistering resistance to some extent in a high-temperature environment, there is a problem with "adhesiveness" that can be easily aligned by exhibiting good temporary adhesion. The problem that "position correction workability", "reworkability" that can be easily re-pasted, and "high temperature-sensitive adhesiveness" that can express strong temperature-sensitive adhesiveness cannot be fully expressed

Method used

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  • Pressure-sensitive adhesive composition and pressure sensitive adhesive tape
  • Pressure-sensitive adhesive composition and pressure sensitive adhesive tape
  • Pressure-sensitive adhesive composition and pressure sensitive adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] To a mixture of 42.50 g of methyl acrylate, 5.00 g of N,N-dimethylacrylamide, and 2.50 g of acrylic acid, add 38.44 g of polycarbonate diol (Nitsupolan 981, Mw=1000, manufactured by Nippon Polyurethane Industry Co., Ltd.) and 9.33 g of hydrogenated xylene diisocyanate (Tahine 1 to 650, manufactured by Takeda Pharmaceutical Co., Ltd.), were heated and stirred at 65° C. under a nitrogen atmosphere for more than 4 hours. While maintaining this state, 2.23 g of 2-hydroxyethyl acrylate was added, followed by heating and stirring for 1 hour or more. 1.00 g of a photopolymerization initiator (IRGACURE651, manufactured by BASF Corporation) was added to the obtained viscous liquid, coated on a polyester release liner to a thickness of 50 μm, and then irradiated with ultraviolet rays for 1 minute (light source: metal halide lamp), An adhesive composition (1) having a thickness of 50 μm was obtained.

[0095] The molar ratio of the polycarbonate diol to the hydrogenated xylene di...

Embodiment 2

[0100] Change the usage-amount of polycarbonate diol into 40.43g, the usage-amount of hydrogenated xylene diisocyanate becomes 8.63g, the usage-amount of acrylate-2-hydroxyethyl ester becomes 0.94g, except that, carry out similarly with embodiment 1, An adhesive composition (2) having a thickness of 50 μm was obtained.

[0101] The molar ratio of the polycarbonate diol to the hydrogenated xylene diisocyanate is 0.081 mol:0.089 mol=1:1.1.

[0102] The molar ratio of the polycarbonate diol to the 2-hydroxyethyl acrylate is 0.081 mol:0.008 mol=1:0.1.

[0103] The adhesive composition (2) is formed by crosslinking the polymer skeleton (a) derived from the acrylic copolymer (A) through the polymer skeleton (b) derived from the urethane (meth)acrylate (B) The adhesive composition of the obtained cross-linked polymer, the content ratio of the polymer skeleton (a) to the polymer skeleton (b) in the cross-linked polymer structure, in terms of weight ratio, (a): (b) =50.00g:50.00g=50:...

Embodiment 3

[0106]Change the usage-amount of polycarbonate diol into 36.64g, the usage-amount of hydrogenated xylene diisocyanate becomes 9.96g, the usage-amount of acrylate-2-hydroxyethyl ester becomes 3.40g, except that, carry out similarly with embodiment 1, An adhesive composition (3) having a thickness of 50 μm was obtained.

[0107] The molar ratio of the polycarbonate diol to the hydrogenated xylene diisocyanate is 0.073 mol:0.103 mol=1:1.4.

[0108] The molar ratio of the polycarbonate diol to the 2-hydroxyethyl acrylate is 0.073 mol:0.029 mol=1:0.4.

[0109] The adhesive composition (3) is formed by cross-linking the polymer skeleton (a) derived from the acrylic copolymer (A) through the polymer skeleton (b) derived from the urethane (meth)acrylate (B) The adhesive composition of the obtained cross-linked polymer, the content ratio of the polymer skeleton (a) to the polymer skeleton (b) in the cross-linked polymer structure, in terms of weight ratio, (a): (b) =50.00g:50.00g=50:...

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Abstract

Provided is a pressure-sensitive adhesive composition capable of sufficiently expressing each of attachment position correction workability that enables a pressure-sensitive adhesive tape containing the composition to be easily aligned by the expression of good temporary attachment property, reworkability that enables the tape to be easily reattached, and temperature-sensitive strong pressure-sensitive adhesiveness that enables the tape to express strong temperature-sensitive pressure-sensitive adhesiveness. Also provided is a pressure-sensitive adhesive tape containing such pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a cross-linked polymer in which an acrylic copolymer (A) is cross-linked by a polyurethane (meth)acrylate (B), in which the acrylic copolymer (A) includes a copolymer of monomers essentially containing a (meth)acrylate and a (meth)acrylamide.

Description

technical field [0001] The present invention relates to adhesive compositions and adhesive tapes. Background technique [0002] When adhering an adhesive tape to various adherends, it is required to easily and firmly adhere to a predetermined position of the adherend. Therefore, the pressure-sensitive adhesive tape is required to have both "attachment position correction workability" that can be easily aligned by exhibiting good temporary adhesiveness and "reworkability" that can be easily reattached. In addition, in recent years, "high temperature-sensitive adhesiveness" capable of expressing strong temperature-sensitive adhesiveness has also been demanded in order to apply to applications related to small batteries and electronic equipment. As an adhesive having such "temperature-sensitive adhesiveness", hot-melt adhesives using thermoplastic resins have been known conventionally. Applied to double-sided adhesive tapes without substrates, etc. [0003] Recently, an adhe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J151/08C09J7/02
CPCC09J7/02C09J151/08C08F290/067C09D151/08C09J7/385Y10T428/14Y10T428/2887C08F220/56C08F220/1811C08F220/54C08F220/06C08F220/20C09J133/04C09J175/04C09J2203/00C09J7/22C09J7/30C09J2301/302C09J2301/416
Inventor 中西多公岁井本荣一
Owner NITTO DENKO CORP
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