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Laser cutting method

A laser processing method and laser cutting technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of difficult removal of debris, thermal damage of parts, etc., and achieve low cost, reduce sewage discharge, and reduce pollution. Effect

Active Publication Date: 2013-07-24
KUNSHAN THETA MICRO
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The technical problem to be solved by the present invention is that in the process of laser processing small-diameter pipes, the heat generated will cause thermal damage to the parts and the debris is not easy to remove. A laser cutting processing method is provided, which has the advantages of heat generated on the parts. The advantages of small damage and easy removal of debris generated during the cutting process

Method used

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Embodiment 1

[0054] This embodiment provides a laser cutting processing method, which includes the following steps: fixing the pipe to be cut on the rotating shaft of the cutting machine; Insert; start the rotating shaft of the laser cutting machine to rotate the pipe to be cut; start the water guide system of the laser cutting machine to rotate the water pipe; start the water circulation module of the laser cutting machine; start the cutting head of the laser cutting machine to cut the pipe; among them, The laser cutting machine, such as figure 1 As shown, it includes coaxial water jet module I, material receiving module II, two-dimensional motion platform III, dust collection module IV and water circulation module V; two-dimensional motion platform III includes linear axis 1 and rotary axis 2, and rotary axis 2 is installed On the slide rail of the linear shaft 1, the rotating shaft 2 clamps the pipe 3 through the pipe clamp 4 and rotates at high speed, and at the same time moves along t...

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Abstract

The invention relates to a laser cutting method which mainly solves the problems in the prior art that when a laser cutting machine processes a pipe with a small diameter, the produced heat damages parts and chips are not easily removed. The laser wet cutting method comprises the following steps that the pipe to be cut is fixedly arranged on the rotary shaft of the cutting machine, a water guiding pipe of the water guiding system of the cutting machine is inserted from one end of the thin-wall pipe to be cut, the laser cutting machine is started so that the pipe to be cut rotates, the water guiding system of the laser cutting machine is started so that the water guiding pipe rotates, the water circulation module of the laser cutting machine is started, and the cutting head of the laser cutting machine is started to cut the pipe. Due to the adoption of the technical scheme, the problems are well solved, and the laser cutting method can be used in the industrial production of laser cutting machining.

Description

[0001] technical field [0002] The invention relates to a laser wet cutting processing method for thin-walled pipes, in particular to a laser wet cutting processing method with a pre-spray water guiding system. Background technique [0003] Laser cutting technology is widely used in the processing of metal and non-metal materials due to its advantages of reducing processing time, reducing processing costs and improving workpiece quality, and laser cutting processing is gradually replacing traditional cutting tools. [0004] Laser micromachining has become the main method for thin-walled pipe processing due to its high processing efficiency, less cutting residue, non-contact processing, and easy automation of the processing process. The laser cutting of thin-walled pipe is to move the overlapping laser pulse points along the cutting line on the pipe, and at the same time input high pressure oxygen to assist melting and cutting. The material at the laser focus point is melte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/04B23K26/14B23K26/42B23K26/146
Inventor 魏志凌宁军夏发平马秀云
Owner KUNSHAN THETA MICRO
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