Light-emitting element mounting package, manufacturing method thereof, and light-emitting element package
A technology for a light-emitting element and a manufacturing method, which is applied in the directions of electrical components, electric solid-state devices, circuit thermal devices, etc., can solve the problems of insufficient heat dissipation paths, heat can not be effectively transferred to radiator plates, etc.
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no. 1 example
[0039] [Structure of Light Emitting Element Mounting Package of First Embodiment]
[0040] The structure of the light emitting element mounting package of the first embodiment will be described. figure 1 An exemplary plan view of the light emitting element mounting package of the first embodiment. Figure 2A for figure 1 Exemplary enlarged plan view of section A of . Figure 2B for along Figure 2A Exemplary cross-sectional view of line B-B.
[0041] refer to figure 1 as well as Figure 2A and Figure 2B , the light-emitting element mounting package 1 includes: substrate 10; adhesive layer 20; wiring 30 (including wiring 31 and 32 and bus 33); electroplating film 40 (including electroplating film 41, 42, 43, 44 and 45); through wiring 50 ( including through wirings 51 , 52 , and 53 ); and an insulating layer 60 . Referring to FIG. 2 , an area C surrounded by a two-dot chain line is finally cut along the two-dot chain line so as to become an area of a separate light e...
no. 2 example
[0105] In the second embodiment, an exemplary manufacturing method of a light emitting element mounting package different from that of the first embodiment is described. In the second embodiment, descriptions of the same constituent elements as those described in the above description of the first embodiment are omitted.
[0106] Figure 7 is an exemplary cross-sectional view of a light emitting element mounting package 1A of the second embodiment. Figure 8 It is a sectional view of the light emitting device package 100A of the second embodiment.
[0107] refer to Figure 7 , the schematic structure of the light emitting element mounting package 1A is the same as that of the light emitting element mounting package 1 of the first embodiment (see figure 1 Similar to Figure 2). However, in the light emitting element mounting package 1A, the area of the upper surface of the wiring 32 and the area of the upper surface of the plating film 42 are larger than the areas of the...
no. 3 example
[0121] In the third embodiment, an exemplary manufacturing method of a light emitting element mounting package different from that of the first embodiment is exemplified. In the third embodiment, descriptions of the same constituent elements as those in the above-described embodiments are omitted.
[0122] [Structure of Light Emitting Element Mounting Package of Third Embodiment]
[0123] The structure of the light emitting element mounting package of the third embodiment is described. Figure 11 It is an exemplary plan view of the light emitting element mounting package of the third embodiment. Figure 12A for Figure 11 Exemplary enlarged plan view of section A (enclosed by dashed lines) of . Figure 12B for along Figure 12A Exemplary cross-sectional view of line B-B.
[0124] refer to Figure 11 as well as Figure 12A and Figure 12B , light emitting element mounting package 1C and light emitting element mounting package 1 (see figure 1 , Figure 2A and Figure ...
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