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Adhesive tape attaching method

A technology of adhesive tape and adhesive layer, applied in the direction of bonding method, film/sheet adhesive, adhesive, etc., can solve the problem of adhesive layer residue residue, etc., and achieve the effect of deviation suppression

Active Publication Date: 2013-12-04
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, there is a problem that, in the case of using an adhesive tape that submerges the bump, the adhesive layer remains as residue on the surface of the bump or the device anyway.

Method used

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  • Adhesive tape attaching method
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  • Adhesive tape attaching method

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Embodiment Construction

[0044] like figure 1 As shown, the present invention relates to an adhesive tape sticking method of sticking an adhesive tape 20 on the surface of a wafer 11 having a device region 17 formed with a plurality of devices 15, 15 and a peripheral remaining region surrounding the device region 17. 19. The adhesive tape 20 has an annular adhesive layer 22 corresponding to the remaining area 19 of the outer periphery.

[0045] like figure 1 As shown, the wafer 11 to be processed is composed of, for example, a silicon wafer with a thickness of 700 μm, and a plurality of intersecting planned dividing lines (spacer lanes) 13, 13 are formed on the surface 11a in a grid pattern, and when passing through the plurality of planned dividing lines, Devices 15, 15 are formed in a plurality of regions divided by lines 13, 13, respectively. On the surface of each device 15, 15, bumps 14, 14 serving as electrodes are arranged. The wafer 11 thus constituted has, on its surface 11 a , a device re...

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Abstract

The invention provides an adhesive tape attaching method used for realizing a state of configuring an annular adhesive layer in the most appropriate position when attaching an adhesive tape equipped with the annular adhesive layer to a wafer. The adhesive tape attaching method includes an aligning step of positioning the central portion of the wafer directly below the central portion of an adhesive tape, a partial attaching step of pressing the adhesive tape on the front side of the wafer by using an attaching roller positioned so as to cover the diameter of the adhesive tape passing through the central portion of the adhesive tape, thereby attaching a part of the adhesive tape to the wafer at a position where the central portion of the adhesive tape is superimposed on the central portion of the wafer, and an attaching step of rotationally moving the attaching roller from the central portion of the wafer to the radially opposite outer circumferential portions of the wafer after performing the partial attaching step, thereby attaching the adhesive tape to the wafer.

Description

technical field [0001] The present invention relates to a method of attaching an adhesive tape having an adhesive layer only on the remaining area of ​​the outer periphery of a wafer surrounding a device area. Background technique [0002] Along with high-density mounting of semiconductor devices, semiconductor chips and substrates are bonded using bumps made of solder or the like. For example, when directly bonding a semiconductor chip and a substrate, spherical bumps with a diameter of about 100 μm are often used. [0003] A wafer with bumps formed on the front side is subjected to thinning processing by grinding the back side of the wafer, and after thinning, is divided to manufacture semiconductor chips on which bumps are arranged. [0004] When performing thinning processing by grinding, the surface side of the wafer on which the bumps are arranged is protected by an adhesive tape, the wafer is held by a suction holding surface or the like through the adhesive tape, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/683C09J7/22C09J7/30
CPCH01L21/78H01L2221/68386H01L2221/68327B29C65/5064H01L21/30H01L2221/68318C09J5/00H01L21/304H01L21/67132H01L21/6836C09J2203/326C09J7/0239H01L2221/6834C09J7/02H01L21/67C09J7/22C09J7/30Y10T156/10
Inventor 樋田美玲
Owner DISCO CORP