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Light-emitting device

A technology of light-emitting diodes and components, which is applied in the directions of electrical components, semiconductor devices, and electric solid-state devices, etc., can solve the problems such as the inability to fix the position of the light-emitting diode unit 12, the reduction of luminous efficiency, and the difficulty of current diffusion.

Inactive Publication Date: 2014-02-12
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, when the rectangular LED unit 12 is connected, the connection circuit needs to be designed according to the shape of the substrate 10, so that the position of the electrical connection area (16, 18) relative to the LED unit 12 cannot be fixed, and the electrical connection area will often be designed at the corner of the LED unit 12
Such a design makes the distance between the electrical connection regions of each light-emitting diode unit 12 different (such as Figure 1B The spacing d and d' shown in the figure), the voltage drop between the light-emitting diode units 12 is different, and it is easy to cause the problem of uneven luminous brightness between the light-emitting diode units 12
When the electrical connection areas (16, 18) are arranged at the corners, since the corners are at right angles, the current is not easy to spread, and the luminous efficiency is also easily reduced.

Method used

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Embodiment Construction

[0021] Various embodiments of the present invention are described below with reference to the drawings. first, Figure 3A and Figure 3B The structure of a light emitting diode unit 22 of the first embodiment of the present invention is shown. The light-emitting diode unit 22 is a regular hexagon and is arranged on the substrate 20, including a first semiconductor layer 223 (for example, an n-type semiconductor layer), a light-emitting layer 222, and a second semiconductor layer 221 (for example, a p-type semiconductor layer). ), a first electrical connection region 26 and a second electrical connection region 28 . Wherein, the n-type semiconductor layer 223 of the LED unit 22 includes a first electrical connection region 26, and the first electrical connection region 26 is configured along the first side 21; and the p-type semiconductor layer 221 of the LED unit 22 A second electrical connection area 28 is included, and the second electrical connection area 28 is disposed ...

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Abstract

A light-emitting diode device is disclosed, which includes a substrate; a plurality of light-emitting diode units, each of the light-emitting diode units being an equilateral polygon with more than four sides, are disposed on the substrate; wherein each of the light-emitting diode units includes a first electrical connecting area disposed along a first side of the light-emitting diode unit, a second electrical connecting area disposed along a second side of the light-emitting diode unit, and a conductive connecting structure disposed on each of the electrical connecting areas; wherein each of the electrical connecting area electrically connects to one another light-emitting diode unit through the conductive connecting structure.

Description

technical field [0001] The present invention relates to a light emitting diode device, in particular to a light emitting diode device structure in which several light emitting diode units are formed on a single substrate. Background technique [0002] The light-emitting diode (LED) is different from the traditional light source in its light-emitting principle and structure. It has the advantages of low power consumption, long component life, no need to warm up the lamp, and fast response speed. It is easy to make extremely small or array components according to the application requirements, and is widely used in the market, such as optical display devices, laser diodes, traffic signs, data storage devices, communication devices, lighting devices, and medical devices, etc. [0003] Existing light emitting diode elements 1 such as Figure 1A and Figure 1B As shown, it includes a substrate 10 and several LED units 12 arranged closely on the substrate 10 . Each LED unit 12 i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62
CPCH01L33/08H01L27/153H01L33/20H01L33/62H01L2224/48091H01L2924/00014
Inventor 李先伟
Owner EPISTAR CORP