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Surface contact spring

A technology of surface contact and contact plate, applied in the direction of contact parts, etc., can solve the problems that the contact plate and the contact piece cannot achieve surface contact, and the elastic distribution of the deformed plate is uneven, so as to achieve weight reduction, material reduction, and contact area reduction. Effect

Inactive Publication Date: 2014-05-14
XIAN BLUE DIAMOND ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the contact piece is not parallel to the limit device, the contact between the deformation plate and the limit device is only a line contact, resulting in uneven distribution of the elastic force of the deformation plate, so that the contact between the contact plate and the contact piece cannot achieve surface contact

Method used

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Examples

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Embodiment Construction

[0029] A surface contact spring, comprising a contact plate 2, a left deformed plate 11 connected to the left end of the contact plate 2, a right deformed plate 12 connected to the right end of the contact plate 2, the left deformed plate 11, the contact plate 2 and the right deformed plate The plate 12 is an integral structure, the free end of the left deformed plate 11 is bent upwards, and the free end of the right deformed plate 12 is bent upwards. The connection between the contact plate 2 and the deformation plate adopts an arc transition to strengthen the strength of the surface contact spring.

[0030] Such as figure 2 , 5 As shown, the free end of the left deformed plate 11 bends to the right, the free end of the right deformed plate 12 bends to the left, the free end of the left deformed plate 11 does not touch the free end of the right deformed plate 12 and does not contact the contact plate 2 . The left deformation plate 11, the contact plate 2 and the right def...

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PUM

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Abstract

The invention provides a surface contact spring having torsion. The surface contact spring comprises a contact plate, a left deformation plate connected with the left end of the contact plate and a right deformation plate connected with the right end of the contact plate, wherein the left deformation plate, the contact plate and the right deformation plate are in an integrated structure. The free end of the left deformation plate is in turn-back bending upwardly; the free end of the right deformation plate is in turn-back bending upwardly; and the two side edges of the deformation plates adjacent to the connection ends of the contact plate are respectively provided with a gap. The arrangement of the gaps in the deformation plate does not influence the deformation of the deformation plates, and meanwhile, the contact plate area of the deformation plates and a contact object is reduced, so that the surface, contacted with the deformation plates, of the fixing sleeve can form a larger deflection angle relatively to the contact plate.

Description

technical field [0001] The invention relates to a surface contact spring. Background technique [0002] The existing helical wire spring can only form line contact with the surface of the contacted object, such as figure 1 As shown, the line contact is easy to cause the deformation of the surface of the contacted object, and this structure will cause great inconvenience in use when the contact plate is required to be high. For example, in order to make the contact piece in the socket produce a certain elasticity, a spring is arranged on one side of the contact piece, and the elastic force of the spring makes the contact piece elastic, but there is a line contact between the spring and the contact piece, and the spring holds the contact piece for a long time. After the pressure is applied, the contact piece will be deformed. After the contact piece in the socket is deformed, the contact with the plug will be poor, so a surface contact spring is needed. [0003] The deformat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/18
Inventor 王水平
Owner XIAN BLUE DIAMOND ELECTRONICS
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