Organic el displays and electronic devices
A display and organic technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of short life, unstable light emission, low display stability, etc., and achieve the effect of narrow frame, suppression of deterioration, and improved reliability.
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Deformed example 2
[0043] Modification 2 (an example provided with a third separation tank)
[0044] Modification 3 (The metal layer is arranged closer to the outer edge than the second separation groove)
[0045] Modification 4 (example in which a removal portion formed by removing the organic insulating layer in the entire region to the end of the substrate is provided instead of the first separation groove)
[0046] 3. Application examples (application examples of electronic equipment)
Embodiment approach
[0048] [Overall configuration example of an organic EL display]
[0049] figure 1 A cross-sectional configuration of an organic EL display (organic EL display 1 ) according to an embodiment of the present disclosure is shown. The organic EL display 1 is used as an organic EL television receiver or the like. as in figure 2 As shown in , a display region 110A and a peripheral region 110B are disposed on a substrate 11 . The peripheral area 110B is disposed on the outer edge of the display area 110A. The organic EL display 1 may be, for example, a top emission display (see Figure 5 ), in which light of any one color of R (red), (G) green, and B (blue) is emitted from the top surface side (with the substrate 11 on the opposite side of the surface) output. It should be noted that figure 1 is along figure 2 A cross-sectional view of the organic EL display 1 shown in line I-I. image 3 shown in figure 1 An example of the overall configuration of the organic EL display 1 ...
Deformed example 1
[0096] Figure 7 A cross-sectional configuration of an organic EL display (organic EL display 1A) according to Modification 1 is shown. The organic EL display 1A is different from the above-described embodiments in that the high-resistance layer 163 is provided between the organic layer 160 and the upper electrode 162 .
[0097] as in Figure 7 As shown in , the high-resistance layer 163 may, for example, be provided wider than the formation region of the organic layer 160 so as to cover the top surface and side surfaces (end surfaces) of the organic layer 160 . The end face of the high-resistance layer 163 is sealed by the conductive layer 160 and the upper electrode 162 in a similar manner to the organic layer 160 in the above-described embodiment. Examples of materials for the high-resistance layer 163 may include materials with 1 Ωcm to 10 7 Ωcm resistance material. Specific examples of the material of the high resistance layer 163 may include niobium oxide (NbOx), tit...
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