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Power semiconductor modules with liquid cooling

A technology for power semiconductors and cooling liquids, which is applied in semiconductor devices, semiconductor/solid-state device components, cooling/ventilation/heating transformation, etc., and can solve problems such as uneven cooling of components and thermal loads

Active Publication Date: 2017-04-26
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

(Seen in the direction of flow of the cooling liquid) Components arranged one behind the other in the module are therefore cooled unevenly and are therefore subjected to different thermal loads, which limits the life of the entire module to the worst cooled component within the lifetime

Method used

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  • Power semiconductor modules with liquid cooling
  • Power semiconductor modules with liquid cooling
  • Power semiconductor modules with liquid cooling

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] figure 1 A power semiconductor module 50 is shown in plan view from above, which consists of a base plate 1 , a cooling system 2 arranged below the base plate and a substrate 3 applied to the base plate 1 , the power semiconductor components 6 may be located on the substrate. The power semiconductor module 50 is generally rectangular and therefore has longer sides (referred to below as longitudinal sides) and shorter sides (referred to below as lateral sides). The orientation is specified as portrait and landscape accordingly. The geometry of the semiconductor modules can also be square. In this case the longitudinal and transverse sides should be of equal length. However, for ease of description, a non-square embodiment is described here as an example.

[0016] different from in figure 1 As shown in the example in , the substrate 3 itself can take over the function of the base plate. In this context, "baseplateless" modules are often also referred to. In the sen...

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PUM

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Abstract

A power semiconductor module includes a substrate and a two-part cooling system arranged under the substrate. The cooling system has upper and lower pieces. The upper piece forms a flow channel with the substrate for a cooling liquid. The upper piece has a first inflow and an outflow, through which the cooling liquid can be introduced into the flow channel and removed. The upper piece also has at least one second inflow, which is spaced apart from the first inflow in a longitudinal direction. The lower piece has an inlet and an outlet, the outlet being connected to the outflow and the inlet being connected to the first inflow. The lower piece also has a channel branching off from the inlet, which includes at least one bypass channel, which is connected to the second inflow, so part of the cooling liquid passes through the bypass channel into the flow channel.

Description

technical field [0001] The invention is in the field of cooling of electronic devices, in particular a power semiconductor module with liquid cooling is described. Background technique [0002] Semiconductor modules and especially power semiconductor modules generate heat during operation at high currents and voltages, which reduces the power and lifetime of those modules if this heat is not dissipated accordingly. In the case of power semiconductor components and modules, liquid cooling is used with correspondingly high power losses in order to ensure sufficient heat dissipation. [0003] In the case of direct liquid cooling, the power semiconductor modules have on their underside a heat exchanger (for example a cooling body), which absorbs heat from the components and transfers that heat to the cooling liquid through direct contact with the cooling liquid. Cool liquid. The cooling liquid is thus heated during flow along the underside of the module, wherein the temperatur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H05K7/20
CPCH05K7/20927H01L23/3672H01L23/473H01L2924/0002H02M7/003H01L2924/00
Inventor T.法特A.尤莱曼
Owner INFINEON TECH AG