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Accurate measurement method for resilience of memory alloy

Active Publication Date: 2015-01-28
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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Problems solved by technology

In the two test methods, the influence of the thermal expansion factor is ignored. The thermal expansion will cause the sample to deform and cause displacement. However, the previous two test methods did not eliminate this factor, resulting in the test results in the heating and cooling process. The actual value There is a certain gap, especially when the heating and cooling mode changes, the gap may reach tens of MPa

Method used

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  • Accurate measurement method for resilience of memory alloy
  • Accurate measurement method for resilience of memory alloy
  • Accurate measurement method for resilience of memory alloy

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Embodiment Construction

[0021] The technical scheme of the present invention will be described in further detail below in conjunction with accompanying drawing and embodiment:

[0022] See attached Figure 2~3 As shown, the memory alloy tested in this embodiment is Ni47Ti44Nb9 bar and wire, and the nominal composition of the bar is Ni47Ti44Nb9. Φ1mm.

[0023] In this example, the WDT-5 microcomputer-controlled electronic universal material testing machine made in China is used, with a maximum load of 5kN, a test temperature range of -100°C to 200°C, and a test system of KPTestV4.3 and related software. Choose the built-in sensor, the sensor uses imported electronic extensometer, and the working temperature is -100℃~200℃.

[0024] The steps of the precise testing method of this memory alloy resilience are:

[0025] (1) Fix the two ends of the bar or wire sample 2 on the upper and lower chucks 1 of the self-kinetic stretching machine respectively, and then install the built-in displacement sensor 3 ...

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Abstract

The invention discloses an accurate measurement method for resilience of memory alloy. The method comprises the step of configuring a displacement sensor on an automatic mechanical stretcher to eliminate thermal expansion and other factors which interfere with the test result. Compared with the prior art, the technical scheme disclosed by the invention has the advantages that the method considers the influence of the thermal expansion factor due to external temperature on the resilience, so as to measure the resilience of the memory alloy more accurately.

Description

technical field [0001] The method is an accurate test method for the recovery force of memory alloys, and belongs to the technical field of memory alloy characteristic testing. Background technique [0002] With the development of memory alloy research and application technology, in addition to the phase transition temperature, some structural parts also need to achieve a certain recovery force. Resilience. In recent years, in response to the above application requirements, there is a test of resilience, and the test technology of resilience is still in its infancy. [0003] At present, there are roughly two methods for testing the recovery force of memory alloys in China: one is to use the wire to provide a small maintenance tension after pre-stretching on the testing machine to ensure the straight state of the wire, and then heat it with electricity to measure the resulting tension. , minus the maintaining tensile force, to obtain the restoring force; the other is to pro...

Claims

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Application Information

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IPC IPC(8): G01N3/08
Inventor 韩劲洪起虎王二敏倪志铭杨根林
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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