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A method for analyzing electronic equipment faults

A technology for equipment failure and electronic analysis, applied in the direction of electronic circuit testing, etc., can solve problems such as manslaughter chips

Inactive Publication Date: 2017-08-25
GUANGDONG XIAOTIANCAI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the motherboard is not glued, if it is not the fault caused by the currently replaced chip, there will be a problem of killing the chip by mistake

Method used

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  • A method for analyzing electronic equipment faults
  • A method for analyzing electronic equipment faults
  • A method for analyzing electronic equipment faults

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Embodiment Construction

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] An embodiment of the present invention provides a method for analyzing faulty electronic equipment, which is used for analyzing faulty electronic equipment, and avoids killing chips caused by removing undetermined faulty chips from a motherboard. Such as figure 1 As shown, the method includes the following steps:

[0022] Step 101, cuttin...

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Abstract

The embodiment of the invention discloses a method for analyzing failures of electronic equipment. The method in the embodiment of the present invention includes: cutting off the circuit connection between the chip to be analyzed on the main board of the electronic device and the main board, so that the chip to be analyzed does not work when the main board is started; replacing the chip on the main board with a flying wire The chip to be analyzed; wherein, the replacement chip is a chip that can work normally; start the main board to judge whether the main board is working normally; if the main board still cannot work normally when using the replacement chip, judge Other components on the motherboard are faulty. The embodiment of the present invention avoids blindly removing the original chip on the main board, resulting in killing the chip by mistake and damaging the main board.

Description

technical field [0001] The invention relates to the field of electronic equipment manufacturing, in particular to a method for analyzing failures of electronic equipment. Background technique [0002] With the rapid development of science and technology, the manufacturing process of electronic equipment has become more sophisticated, and the electronic equipment itself is also developing in the direction of smaller size and more functions. The number of chips on the motherboard of electronic equipment is also gradually decreasing. Therefore, the integrated chip of some important functional modules must also require a smaller volume. After such a small-sized chip is soldered on the motherboard, it will cause certain difficulties in analyzing the failure of electronic equipment. Since each chip on the electronic equipment is welded by precise welding method when it is mass-produced, when analyzing whether a certain chip is faulty, it is necessary to remove the chip from the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
Inventor 刘华中
Owner GUANGDONG XIAOTIANCAI TECH CO LTD
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