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A circuit board processing method and a multilayer circuit board

A processing method and technology of multi-layer boards, which are applied in the directions of multi-layer circuit manufacturing, printed circuit components, and electrical connection of printed components to achieve the effect of meeting the requirements of product characteristics

Active Publication Date: 2018-04-20
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides a circuit board processing method and a multi-layer circuit board to solve the technical problem of how to make a high-layer ultra-thick copper circuit board with any adjacent layers interconnected

Method used

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  • A circuit board processing method and a multilayer circuit board
  • A circuit board processing method and a multilayer circuit board
  • A circuit board processing method and a multilayer circuit board

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0024] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a circuit board, which may include:

[0025] 110. A multilayer board is provided, the multilayer board includes 2 outer metal layers and 2m inner circuit layers, m buried holes are provided in the multilayer board, wherein the 2i-1th inner circuit layer It is connected with the inner circuit layer of layer 2i through a buried hole, m is an integer greater than 1, i=1, 2...m;

[0026] 120. Make one metallized blind hole on both sides of the multilayer board, wherein the first metallized blind hole on the first side is used to connect the first outer metal layer and the first inner layer circuit layer, and the second The second metallized blind hole on the surface is used to connect the second outer metal layer and the 2mth inner layer circuit layer;

[0027] 130. Make m-1 metallized through holes on the multilayer board, and back-drill each metallized through hole from bo...

Embodiment 2

[0057] Please refer to Figure 3d , the embodiment of the present invention provides a multilayer circuit board, which may include:

[0058] 2 outer circuit layers, 2m inner circuit layers and m+1 insulating dielectric layers, where m is an integer greater than 1; wherein, the 2i-1th inner circuit layer and the 2ith inner circuit layer pass through a Buried hole connection, i=1,2.....m; the 2jth layer inner layer circuit layer and the 2j+1 layer inner layer circuit layer are connected through a bridge hole, j=1,2.....m-1; the 2nd layer An outer circuit layer and the first inner layer circuit layer are connected through the first metallized blind hole, and the second outer layer circuit layer and the 2mth inner layer circuit layer are connected through the second metallized blind hole; the multilayer circuit A spiral current path is formed in the board through the buried hole and the bridging hole as well as the first metallized blind hole and the second metallized blind hole....

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Abstract

The invention discloses a circuit board processing method and a multi-layer circuit board to solve the technical problem of how to manufacture a high-layer ultra-thick copper circuit board with any adjacent layers interconnected. The method may include: providing a multilayer board, the multilayer board comprising 2 outer metal layers and 2m inner wiring layers, wherein the 2i-1th inner wiring layer and the 2ith inner wiring layer are buried Hole connection, m is an integer greater than 1, i=1, 2.....m; make a metallized blind hole on both sides of the multi-layer board, so that the outer metal layer and the adjacent inner circuit layer Connect through metallized blind holes; make m-1 bridging holes on the multi-layer board, wherein the 2jth inner layer circuit layer and the 2j+1th layer inner layer circuit layer are connected through a bridge hole, j=1 , 2...m-1; wherein, a spiral current path is formed through the m buried holes, the m-1 bridging holes and the 2 metallized blind holes.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board processing method and a multilayer circuit board. Background technique [0002] At present, there are generally two processing methods for HDI (High Density Interconnect, high-density interconnection or arbitrary layer interconnection) circuit boards: one is hole filling electroplating plus stacked hole technology, and the other is blind hole electroplating plus multiple pressing technology. [0003] At present, there are more and more application fields of high-layer ultra-thick copper circuit board products, and their application scenarios are also different. Among them, there is a circulation technology that requires the interconnection of any adjacent layers of high-layer ultra-thick copper circuit boards, and ensures that the current is formed Spiral loop current. [0004] However, if hole-filling electroplating plus stacked hole technology is used, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K3/46H05K1/02H05K1/11
Inventor 郭长峰刘宝林张学平罗斌
Owner SHENNAN CIRCUITS
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