A circuit board processing method and a multilayer circuit board

A processing method and technology of multi-layer boards, which are applied in the directions of multi-layer circuit manufacturing, printed circuit components, and electrical connection of printed components to achieve the effect of meeting the requirements of product characteristics
CN105101679BActive Publication Date: 2018-04-20SHENNAN CIRCUITS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENNAN CIRCUITS
Publication Date
2018-04-20

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Abstract

The invention discloses a circuit board processing method and a multi-layer circuit board to solve the technical problem of how to manufacture a high-layer ultra-thick copper circuit board with any adjacent layers interconnected. The method may include: providing a multilayer board, the multilayer board comprising 2 outer metal layers and 2m inner wiring layers, wherein the 2i-1th inner wiring layer and the 2ith inner wiring layer are buried Hole connection, m is an integer greater than 1, i=1, 2.....m; make a metallized blind hole on both sides of the multi-layer board, so that the outer metal layer and the adjacent inner circuit layer Connect through metallized blind holes; make m-1 bridging holes on the multi-layer board, wherein the 2jth inner layer circuit layer and the 2j+1th layer inner layer circuit layer are connected through a bridge hole, j=1 , 2...m-1; wherein, a spiral current path is formed through the m buried holes, the m-1 bridging holes and the 2 metallized blind holes.
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Description

technical field

[0001] The invention relates to the technical field of circuit boards, in particular to a circuit board processing method and a multilayer circuit board. Background technique

[0002] At present, there are generally two processing methods for HDI (High Density Interconnect, high-density interconnection or arbitrary layer interconnection) circuit boards: one is hole filling electroplating plus stacked hole technology, and the other is blind hole electroplating plus multiple pressing technology.

[0003] At present, there are more and more application fields of high-layer ultra-thick copper circuit board products, and their application scenarios are also different. Among them, there is a circulation technology that requires the interconnection of any adjacent layers of high-layer ultra-thick copper circuit boards, and ensures that the current is formed Spiral loop current.

[0004] However, if hole-filling electroplating plus stacked hole technology is used, ...

Claims

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