Efficient heat dissipation paster type packaging structure
A packaging structure and chip-type technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of no heat dissipation structure and poor heat dissipation performance, so as to prolong the service life, avoid avalanche phenomenon, and protect components. Effect
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[0043] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be pointed out that for those of ordinary skill in the art, a number of modifications and improvements can be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0044] In this embodiment, the high-efficiency heat dissipation SMD package structure provided by the present invention includes a first heat dissipation substrate 2, a second heat dissipation substrate 11 and a chip 1; wherein the chip 1 is provided with a collector, a source 3 and a gate. Pole 4; the collector is connected to the first heat dissipation substrate 2; the source 3 or gate 4 is connected to the second heat dissipation substrate 11.
[0045] The high-efficiency...
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