Low-temperature rapidly-vulcanized solid silicon rubber raw material and production method thereof

Abstract

The invention discloses a low-temperature rapidly-vulcanized solid silicon rubber raw material and a production method thereof. The solid silicon rubber raw material contains a silicon rubber raw material, a platinum vulcanizing agent and a color masterbatch which are uniformly mixed together, wherein the platinum vulcanizing agent comprises the main components A and B; the component A is a mixture containing raw vinyl rubber, fumed silica and a platinum complex; the component B is a mixture containing raw vinyl rubber, fumed silica, terminated poly(methylhydrosiloxane) and an inhibitor; the weight ratio of the component A to the component B is 1:1 to 3:1; the mixing ratio of the platinum vulcanizing agent to the silicon rubber raw material is 100:0.1 to 100:5.0; the color masterbatch comprises the following components: raw silicon rubber, an organic toner, silicon oil and a dispersing agent; and the mixing ratio of the mixture of the silicon rubber and the platinum vulcanizing agent to the color masterbatch is 100:0.1 to 100:3.0. The solid silicon rubber raw material disclosed by the invention is particularly suitable for integrally molding a high-temperature-nonresistant material and solid silicon rubber.

Description

technical field [0001] The invention relates to the production and application of solid silica gel, in particular to a low-temperature rapid vulcanization solid silica gel raw material and a production method thereof. Background technique [0002] With the continuous expansion of the application range of solid silica gel, the molding process of solid silica gel has gradually changed from traditional daily necessities to high-precision structural parts such as electrical assemblies, mobile electronic products, and waterproof products. However, due to the fact that the electronic components or the materials integrally formed with them cannot withstand the high temperature of solid silicone molding (the conventional temperature is about 170°, the lowest is about 130°C), and the electronic components or With the problem of damage or deformation of the integrally formed material (only resistant to 80°~100° temperature), the traditional refining and use process of solid silica gel...

AI Technical Summary

Problems solved by technology

[0002] With the continuous expansion of the application range of solid silica gel, the molding process of solid silica gel has gradually changed from traditional daily necessities to high-precision structural parts such as electrical assemblies, mobile electronic products, and waterproof products. However, due to the fact that the electronic components or the materials integrally formed with them cannot withstand the high temperature of solid silicone molding (the conventional temperature is about 170°, the lowest is about 130°C), and the electronic components or With the problem of damage or deformation of the integrally formed material (only resistant to 80°~100° temperature), the traditional refining and use process of solid silica gel can no longer meet the application requirements of existing high-precision and complex products.

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