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A high-precision isolated boss structure htcc substrate manufacturing method

A technology of an isolated boss type and a manufacturing method, which is applied in circuit substrate materials, printed circuit manufacturing, laminated printed circuit boards, etc., can solve the problems of inability to obtain an isolated convex structure and restricting the high-dimensional application of substrates.

Active Publication Date: 2018-01-16
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limitations of HTCC technology, most of the formed substrates are concave structures, and it is impossible to obtain isolated convex structures through ordinary laminated lamination processes.
This limits the high-dimensional application of the substrate

Method used

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  • A high-precision isolated boss structure htcc substrate manufacturing method

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Embodiment Construction

[0016] A method for manufacturing a high-precision isolated boss structure HTCC substrate, comprising the following process steps:

[0017] 1) Use cast green tape suitable for HTCC process, and perform layer-by-layer punching, hole filling, and printing operations according to product metallization wiring requirements;

[0018] 2) Carry out the first lamination and hot pressing on the lamination board with the metallized pattern filled and printed raw ceramic tape according to the boss part and the base part respectively, and the hot pressing pressure is 100-300psi;

[0019] 3) Laser ablation technology is used to process the hot-pressed green ceramic belt of the boss part according to the size required by the product. all items are retained;

[0020] 4) After laser ablation of the whole stack of raw ceramic tapes on the boss part, use sticky dust rollers or brushes to clean the dust remaining on the surface of the individual boss porcelain parts and the whole stack of cavity...

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Abstract

The invention is a manufacturing method of a high-precision isolated boss-type structure HTCC substrate, which utilizes a multi-layer ceramic co-firing process, selects a green ceramic belt suitable for the HTCC process as the base material, uses tungsten as the metallization material, and adopts a spacer Malan film and The seamless splicing laminate lamination method, the HTCC substrate with isolated boss structure can realize the processing accuracy of the outer boss is 0.10mm, and ensure that the position deviation of the upper and lower layers is less than 0.20mm, ensuring the interconnection and wiring between layers relationship to ensure that the HTCC substrate meets the requirements of various electrical performance indicators of the national military standard.

Description

technical field [0001] The invention relates to a method for manufacturing an HTCC substrate with a high-precision isolated boss structure, is aimed at the method for manufacturing a special-shaped substrate, and belongs to the technical field of HTCC multilayer ceramics. Background technique [0002] High-temperature co-fired ceramics (HTCC) technology is a technology that uses high-melting-point metallization pastes such as tungsten to print on 92-96% alumina tape-cast raw ceramic tapes, and then laminated and laminated at 1500-1600 ° C. The process technology of co-firing at high temperature. Compared with low-temperature co-fired ceramics (LTCC), high-temperature co-fired ceramics (HTCC) have the advantages of high mechanical strength, stable chemical properties, high heat dissipation coefficient and low material cost. [0003] HTCC substrate is a substrate product manufactured based on high temperature co-fired multilayer ceramic technology, which is used in various el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03H05K3/00
CPCH05K1/0306H05K3/0026H05K3/0058H05K2203/107
Inventor 庞学满龚锦林曹坤陈宇宁
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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