Preparing method of electronic packaging material

Abstract

The invention provides a preparing method of an electronic packaging material. The material is composed of a base body and a reinforcement body, the base body comprises an aluminum alloy, and the reinforcement body comprises oxidized grapheme and SiC particles; and the reinforcement body comprises, by mass percentage, 2% of oxidized grapheme, 50% of SiC particles and the balance aluminum alloy powder; the aluminum alloy powder comprises 50% of Al-40Si and 50% of Al alloy powder. Through the method, the light electronic packaging material with the density lower than 3.1g / cm<3> and the thermal conductivity larger than 180W / (m. K) can be prepared, and therefore comprehensive performance of military electronic equipment can be greatly improved; and the method is suitable for productive preparation of portable devices, aerospace, military power mixed circuits of the other fields sensitive to the weight, carriers of microwave tubes, and heat sink and high-power module packaging materials of a multi-chip assembly.

Description

Technical field [0001] The invention relates to a method for preparing packaging materials, in particular to a method for preparing electronic packaging materials with an aluminum alloy matrix and graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of the integrated circuit. It not only has the mechanical support and environmental protection effect on the chip, but also prevents the pollution and erosion of water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a pivotal role in the thermal performance and reliability of electronic devices and circuits. Now, the electronic packaging materials industry has become an important branch of the semiconductor industry, which has been widely involved in chemistry, electricity, thermodynamics, machinery and process equi...

AI Technical Summary

Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

Images