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Electronic packaging material

An electronic packaging material and matrix technology, applied in the field of aluminum alloy matrix and electronic packaging material, can solve problems such as manufacturing process and welding performance problems, improve reliability and integration degree, strong material design, and simple operation process Effect

Inactive Publication Date: 2016-06-01
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The existing SiC / Al composite electronic packaging materials are mainly manufactured by the infiltration method, which has problems in thermal conductivity, manufacturing process and welding performance. The application in my country's active phased array radar requires a new type of packaging material to make up for the shortcomings of traditional materials

Method used

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Embodiment Construction

[0028] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] Calculated by mass fraction, the graphene oxide content is 0.5%-3%, the SiC particle content is 35%-65%, and the balance is Al-Si aluminum alloy powder. The preparation steps are as follows:

[0030] (1) prepare the ethanol solution of graphene oxide: the graphene oxide of 1 volume and the ethanol of 10 volumes are mixed and dispersed with ultrasonic;

[0031] (2) Add the prepared graphene oxide ethanol solution, SiC particles, and Al-Si aluminum alloy powder into a V-type mixing device for wet mixing, mix for ...

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Abstract

The invention provides an electronic packaging material. The electronic packaging material is composed of a base body and a reinforcement body; the base body comprises an aluminum alloy, and the reinforcement body comprises graphene oxide and SiC particles and comprises, by mass percentage, 0.5%-3% of graphene oxide, 35% to 65% of SiC particles and the balance aluminum alloy powder; and the aluminum alloy powder is Al-Si alloy powder. By the adoption of a method, the light electronic packaging material with the density lower than 3.1g / cm<3> and thermal conductivity larger than 180 W / (m K) can be prepared, and therefore the comprehensive performance of a military electronic device can be greatly improved; and the preparing method is suitable for producing and preparing of packaging materials of portable devices, military power hybrid circuits of aerospace and other fields sensitive to weight, carriers of microwave tubes, and heat-sink and super-power modules of a multi-chip assembly.

Description

technical field [0001] The invention relates to an encapsulation material, in particular to an electronic encapsulation material with an aluminum alloy matrix, graphene oxide and SiC particles as reinforcements. Background technique [0002] Electronic packaging material refers to the sealing body of integrated circuits. It not only has mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by water vapor, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can be stably To perform normal electrical functions, packaging materials play a decisive role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, thermodynamics, machinery and process equipme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C29/06C22C30/00C22C32/00
CPCC22C29/065C22C21/02C22C30/00C22C32/0063
Inventor 王旭东李炯利戴圣龙张晓艳杨程
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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