Semiconductor laser for solid-state laser pumping source
A solid-state laser, pump source technology, applied in semiconductor lasers, semiconductor laser devices, lasers, etc., can solve the problems of short service life, poor heat dissipation performance, complex structure, etc., and achieve improved heat dissipation performance, compact structure, and small volume. Effect
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2016-06-22
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Abstract
Description
technical field
[0001] The invention relates to a semiconductor laser, in particular to a semiconductor laser used as a solid laser pump source. Background technique
[0002] Semiconductor-pumped solid-state lasers are the fastest-growing and widely-used new lasers in the world in recent years. This type of laser uses a fixed-wavelength semiconductor laser instead of the traditional krypton lamp or xenon lamp to pump the laser crystal. A new development, called the second generation of lasers. It is a second-generation new solid-state laser with high efficiency, long life, high beam quality, good stability, and compact structure. It has been used in space communication, optical fiber communication, atmospheric research, environmental science, medical equipment, and optical imaging. Processing, laser printers and other high-tech fields have unique application prospects. However, semiconductor lasers currently on the market for solid-state laser pump sources still have many ...
Examples
Embodiment Construction
[0020] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the embodiments described here are only used to explain the present invention, but not to limit the present invention.
[0021] Please refer to Figure 1 to Figure 5 As shown, in this embodiment, a semiconductor laser used as a solid-state laser pump source includes a base 1 on which 7 illuminant assemblies 2 are arranged, and the 7 illuminant assemblies 2 are connected in series, and the adjacent illuminant components 2 are symmetrically arranged on the base 1. The luminous body components 2 include a heat sink 3, and the heat sink 3 is made of a heat-conducting metal material, specifically, it is made of a copper material. A circuit board 8 is installed on the heat sink 3, and a first electrode 4 electrically connected to the circuit board 8 is installed on the left end...