Heat radiation device and electronic equipment

A technology of electronic equipment and heat dissipation device, which is applied in the field of electronic equipment, can solve problems such as exceeding the comfortable temperature, affecting the service life of mobile phones, and affecting user experience, so as to achieve good heat dissipation effect and avoid the effect of heat concentration

Inactive Publication Date: 2016-08-03
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thermal conductivity of common metals is up to about 300W / m·K, and the graphite film is up to about 1000W / m·K, when the CPU power consumption is getting higher and higher, metal or graphite films often cannot meet the heat dissipation requirements of mobile phones. requirements, the surface temperature of the mobile phone will exceed the comfortable temperature perceived by the human body when running a large program load, which will affect the user experience; at the same time, the service life of the mobile phone will also be affected if it is in a high temperature state for a long time

Method used

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  • Heat radiation device and electronic equipment
  • Heat radiation device and electronic equipment

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Embodiment 1

[0018] refer to figure 1 , which shows a schematic structural view of an embodiment of a heat dissipation device of the present invention, the heat dissipation device may specifically include: a metal heat dissipation middle frame 11; wherein, the metal heat dissipation middle frame 11 is a hollow and airtight structure, and the metal heat dissipation middle frame The inside of frame 11 is sealed with volatile liquid.

[0019] In practical applications, mobile phones include components such as LCM (LCDModule, liquid crystal module), PCB (Printed Circuit Board, printed circuit board), battery, etc. These components need to be fixed on a bracket (metal middle frame) to ensure that each component of stability. In the embodiment of the present invention, the metal middle frame is used to dissipate heat from the electronic equipment. Because the metal heat dissipation middle frame 11 of the present invention can be a hollow airtight structure, and a volatile liquid is sealed insi...

Embodiment 2

[0029] refer to figure 2 , which shows a schematic structural diagram of an embodiment of an electronic device according to the present invention, and the electronic device may specifically include: the aforementioned heat dissipation device 21 and heat generating component 22;

[0030] Wherein, the heating component 22 is fixed on the metal heat dissipation middle frame 211 in the heat dissipation device 21; the metal heat dissipation middle frame 211 is a hollow airtight structure, and a volatile liquid is sealed inside it.

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Abstract

Embodiments of the present invention provide a heat dissipation device and electronic equipment, wherein the heat dissipation device specifically includes: a metal heat dissipation middle frame; wherein, the metal heat dissipation middle frame is a hollow and airtight structure, and the inner seal of the metal heat dissipation middle frame is easily Volatile liquid. The embodiment of the present invention can avoid the situation that the temperature of the local area of ​​the electronic equipment is too high due to heat concentration, and achieve better heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment. Background technique [0002] With the continuous development of electronic technology, most of the CPUs of mobile phones and other electronic devices are developing towards multi-core. However, with the continuous improvement of mobile phone performance, the problem of heat generation is becoming more and more serious; , making the heat dissipation space of the mobile phone smaller and smaller, therefore, the heat dissipation of the mobile phone under the condition of limited heat dissipation space becomes particularly important. [0003] Most of the existing solutions use metal or graphite film to dissipate heat from the mobile phone. However, since the thermal conductivity of common metals is up to about 300W / m·K, and the graphite film is up to about 1000W / m·K, when the CPU power consumption is getting higher an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 贾广琪张双华
Owner VIVO MOBILE COMM CO LTD
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