Heat dissipation device and electronic equipment

A technology of electronic equipment and heat dissipation device, applied in the field of electronic equipment, can solve the problems of slow system running speed, crash, surface temperature exceeding comfortable temperature, etc., to avoid system performance and improve heat dissipation effect.

Inactive Publication Date: 2016-08-10
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thermal conductivity of common metals is up to about 300W / m·K, and the graphite film is up to about 1000W / m·K, when the CPU power consumption is getting higher and higher, metal or graphite films often cannot meet the heat dissipation requirements of mobile phones. requirements, the surface temperature of the mobile phone will exceed the comfortable temperature perceived by the human body when running large-scale program loads, which will affect the user experience; in addition, in practical applications, the core of electronic equipment is the CPU, and the CPU will generate a large amount of If the temperature of the CPU is too high, it will seriously affect the processing performance of the CPU, which will cause the system of the electronic device to slow down or even crash.

Method used

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  • Heat dissipation device and electronic equipment
  • Heat dissipation device and electronic equipment
  • Heat dissipation device and electronic equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0019] refer to figure 1 , which shows a schematic structural view of an embodiment of a heat dissipation device of the present invention, the heat dissipation device may specifically include: a metal heat dissipation cover 11; wherein, the metal heat dissipation cover 11 is a hollow airtight structure, and the metal heat dissipation cover 11 The interior is sealed with volatile liquid.

[0020] In practical application, since the metal heat dissipation cover 11 of the present invention can be a hollow airtight structure, and a volatile liquid is sealed inside the metal heat dissipation cover. The metal cooling cover can be covered or covered on the heat-generating parts of the electronic equipment, wherein the heat-generating parts can be any parts that can generate heat, such as CPU (Central Processing Unit, central processing unit) in the electronic equipment, power management unit ( Power Management Unit, PMU), etc. Therefore, when the metal heat dissipation cover 11 is ...

Embodiment 2

[0031] refer to figure 2 , which shows a schematic structural diagram of an embodiment of an electronic device according to the present invention. The electronic device may specifically include: the aforementioned heat dissipation device 21 and a heat generating component 22; the heat dissipation device 21 includes a metal heat dissipation cover 211, and the metal heat dissipation cover 211 is a hollow airtight structure, and its interior is sealed with a volatile liquid; wherein, the metal heat dissipation cover 211 in the heat dissipation device covers the heating component 22, and the metal heat dissipation cover 211 and the heating component 22 are welded on the PCB board superior.

[0032] In the embodiment of the present invention, the heat-generating components may specifically include components that easily generate heat in electronic equipment such as a CPU and a power management unit. Of course, in a specific application, the heat-generating component may be any co...

Embodiment 3

[0038] In yet another preferred embodiment of the present invention, the electronic device may further include a metal middle frame 23 on the basis of the structure shown in Embodiment 2;

[0039] Wherein, the heating component 22 is fixed on the metal middle frame 23 .

[0040] In practical applications, heat-generating components such as CPU and / or power management unit can be directly fixed on the metal middle frame 23 . refer to image 3 , which shows a schematic structural diagram of an electronic device including the heat sink 21 and the metal middle frame 23 of the present invention; alternatively, the CPU and / or power management unit can be fixed on the main board, and then the main board can be fixed on the metal middle frame 23 on. For the side of the metal middle frame 23 that is close to the CPU and / or the power management unit, the metal middle frame 23 can act as a radio frequency shield for the CPU and / or the power management unit; and for the other side of th...

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PUM

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Abstract

Embodiments of the invention provide a heat dissipation device and a piece of electronic equipment. The heat dissipation device specifically comprises a metal heat dissipation cover which is of a hollow sealed structure and has volatile liquid sealed inside. According to embodiments of the invention, the heat produced by a CPU can be dissipated evenly, so the situation in which too high local temperature of the CPU of the electronic equipment affects the system performance is avoided.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment. Background technique [0002] With the continuous development of electronic technology, most of the CPUs of mobile phones and other electronic devices are developing towards multi-core. However, with the continuous improvement of mobile phone performance, the problem of heat generation is becoming more and more serious; , making the heat dissipation space of the mobile phone smaller and smaller, therefore, the heat dissipation of the mobile phone under the condition of limited heat dissipation space becomes particularly important. [0003] Most of the existing solutions use metal or graphite film to dissipate heat from the mobile phone. However, since the thermal conductivity of common metals is up to about 300W / m·K, and the graphite film is up to about 1000W / m·K, when the CPU power consumption is getting higher an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 王小军贾广琪张双华
Owner VIVO MOBILE COMM CO LTD
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