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Co-molded ceramic and polymer structures

A technology of polymer materials and ceramic shells, which is applied to electrical equipment shells/cabinets/drawers, casings/cabinets/drawer parts, and other household appliances, etc.

Active Publication Date: 2019-06-04
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these materials have their own disadvantages
For example, small retention features (e.g., clips, arms, detents, grooves) used to couple housing components together would be relatively simple to mold into a plastic sheet, but may be difficult or impossible to form with glass and ceramics

Method used

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  • Co-molded ceramic and polymer structures
  • Co-molded ceramic and polymer structures
  • Co-molded ceramic and polymer structures

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Embodiment Construction

[0030] Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiment to one preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0031] Housings for electronic devices are increasingly being made of materials other than plastic. For example, the housing may include portions made of ceramic, crystal, glass, metallic materials, and the like. As a specific example, the case of a watch may include a crystal element that acts as a cover for the display or face of the watch, and a ceramic portion that covers the back of the watch (e.g., against the user's skin when worn on the user's wrist). part of the watch). Similarly, the housing of a smartphone or tablet computer (or ...

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Abstract

The present disclosure relates to co-molded ceramic and polymer structures. A method of making a co-molded housing component for an electronic device is disclosed. A part formed from a ceramic material is placed in a mold. The mold includes a first portion defining a first cavity configured to receive the first component, and a second portion defining a second cavity that communicates with the first cavity when the mold is closed. The second cavity is the shape of the feature to be bonded to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first part and the feature together form a housing part for an electronic device.

Description

[0001] Cross References to Related Applications [0002] This application is a non-provisional patent application of and claims the benefit of U.S. Provisional Patent Application No. 62 / 129,868, filed March 8, 2015, and entitled "Co-Molded Ceramic and Polymer Structure," the entire disclosure of which is incorporated by reference here. technical field [0003] The present disclosure relates generally to ceramic and polymer structures, and more particularly to co-molded ceramic and polymer structures for electronic devices. Background technique [0004] Electronic devices often include a housing that encloses some or all of the sensitive and / or delicate components of the electronic device. Such a housing may have mating portions that are cut, glued, bonded, or otherwise secured to each other to form the housing and enclose the electronic components within the housing. [0005] Plastic has traditionally been used in housings for electronic devices, at least in part because o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K5/00B29C45/14B29C39/10
CPCB29C39/10B29C45/14H05K5/00H05K5/02A45C11/00A45C2011/002B29C45/14311B29C2045/14327B29C2045/14868B29K2101/10B29K2101/12B29K2709/02B29K2995/0026B29L2031/3481
Inventor J·C·浦尔K·M·肯尼松雪直人D·I·纳扎罗
Owner APPLE INC