Thin plate-shaped workpiece manufacturing method and double-end plane grinding apparatus

Abstract

The invention provides a thin plate-shaped workpiece manufacturing method and a double-end plane grinding apparatus. According to the invention, whether a worker is high or low in degree of proficiency, the worker can reliably perform desired pre-adjustment for accurately grinding a thin plate-shaped workpiece. The manufacturing method includes: a grinding step of using a double-end plane grinding apparatus to allow a thin plate-shaped workpiece supported by static pressure between a pair of static pressure pads to rotate and using a pair of grinding tools to grind two surfaces of a grinding workpiece; and a pre-adjustment step of performing pre-adjustment on the double-end plane grinding apparatus before the grinding step. In the pre-adjustment step, in a first state (performing static pressure support on an adjustment workpiece and using the grinding tools to clamp the adjustment workpiece) and a second state (do not perform static pressure support on the adjustment workpiece, only using the grinding tool to clamp the adjustment workpiecce), a distance between the adjustment workpiece and the static pressure pads is acquired, and the double-end plane grinding device is adjusted according to variation of the distance in the two states.

Description

technical field [0001] The invention relates to a method for manufacturing thin-plate workpieces and a double-head surface grinding device. Background technique [0002] For example, a horizontal double-head surface grinding device is configured to include a pair of left and right static pressure pads and a pair of left and right grinding tools, and to use the static pressure pads to statically grind the workpiece from both sides of a thin plate-shaped workpiece such as a silicon wafer. Grinding is carried out by clamping the workpiece from both sides of the workpiece with a pair of rotating grinding stones while rotating the workpiece around the central axis under pressure support (see, for example, Patent Document 1). [0003] In this double-head surface grinding device, since the workpiece being ground is supported at two different positions by two supporting units, namely, the static pressure pad and the grinding tool, for example, once it is supported by these two suppo...

AI Technical Summary

Problems solved by technology

[0003] In this double-head surface grinding device, since the workpiece being ground is supported at two different positions by two support units, namely, the static pressure pad and the grinding tool, for example, once it is supported by these two support units, If the supporting position of the workpiece is staggered in the axial direction, that is, in the thickness direction of the workpiece, bending stress will be generated on the workpiece, making it impossible to perform high-precision grinding

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