Manufacturing method of thin-plate workpiece and double-head surface grinding device

Abstract

The present invention provides a method for manufacturing a thin-plate workpiece and a double-head surface grinding device. According to the present invention, regardless of the operator's level of proficiency, it is possible to reliably perform pre-processing required for high-precision grinding of a thin-plate workpiece. Adjustment. This manufacturing method includes: using a double-head surface grinding device, while rotating a thin-plate-shaped workpiece supported by static pressure between a pair of static pressure pads, grinding both surfaces of the workpiece with a pair of grinding tools. Grinding step; a pre-adjustment step for adjusting the double-head surface grinding device before performing the grinding step. In the pre-adjustment step, in the first state (while the workpiece for adjustment is supported by static pressure, the workpiece for adjustment is clamped by the grinding wheel), the second state (the workpiece for adjustment is not supported by static pressure, only by the grinding wheel) The distance between the adjustment workpiece and the static pressure pad is obtained under the grinding tool to clamp the adjustment workpiece, and the double-head surface grinding device is adjusted according to the change in the distance between these two states.

Description

technical field [0001] The invention relates to a method for manufacturing thin-plate workpieces and a double-head surface grinding device. Background technique [0002] For example, a horizontal double-head surface grinding device is configured to include a pair of left and right static pressure pads and a pair of left and right grinding tools, and to use the static pressure pads to statically grind the workpiece from both sides of a thin plate-shaped workpiece such as a silicon wafer. Grinding is carried out by clamping the workpiece from both sides of the workpiece with a pair of rotating grinding stones while rotating the workpiece around the central axis under pressure support (see, for example, Patent Document 1). [0003] In this double-head surface grinding device, since the workpiece being ground is supported at two different positions by two supporting units, namely, the static pressure pad and the grinding tool, for example, once it is supported by these two suppo...

AI Technical Summary

Problems solved by technology

[0003] In this double-head surface grinding device, since the workpiece being ground is supported at two different positions by two support units, namely, the static pressure pad and the grinding tool, for example, once it is supported by these two support units, If the supporting position of the workpiece is staggered in the axial direction, that is, in the thickness direction of the workpiece, bending stress will be generated on the workpiece, making it impossible to perform high-precision grinding

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