Method for manufacturing metal matrix printed circuit board embedded with ceramic chip

A technology of printed circuit boards and production methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit dielectrics, etc., can solve the problems of high cost, low withstand voltage, and the inability to share printed circuit board production lines, etc., to achieve accurate production, High thermal conductivity, cost-effective effect

Active Publication Date: 2016-11-09
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, metal-based printed circuit boards with high thermal conductivity include copper-based boss boards (also known as thermoelectric separation copper substrates), ceramic-based printed circuit boards, ALC boards (Chinese: diamond-like carbon printed circuit boards), etc., each product All have certain defects. For example, although the thermal conductivity of

Method used

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Embodiment Construction

[0028] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] The present invention will be further explained below in conjunction with some examples. It should be understood that the following examples are intended to illustrate and should not be regarded as limiting the present invention.

[0030] A method for manufacturing a metal-based printed circuit board embedded with ceramic sheets, comprising:

[0031] Step 1: Put the ceramic sheet into the hole of the metal base;

[0032] Step 2: Cover the RCC, put the RCC with the protective film off on the metal substrate where the ceramic ...

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Abstract

The invention discloses a method for manufacturing a metal matrix printed circuit board embedded with a ceramic chip. The method comprises the following steps: placing a ceramic chip to holes of a metal matrix; sleeving a RCC, sleeving the RCC which is peeled off a protective membrane to the metal matrix which is placed with the ceramic chip therein; tacking, putting the metal matrix embedded with the ceramic chip to a tacking jig at a speed of 0.6m/min; laminating, curing a resin and at the same time adhering the ceramic chip to the metal matrix; cutting glue-spilling, removing the resin which spreads to the surface from the holes; conducting regular metal substrate procedure. The method manufactures an aluminum base and the RCC separately, achieves accurate manufacturing of the circuit boards, can manufacture a printed circuit boards with embedded ceramic chip that has the high heat conduction property of the ceramic chip and can be manufactured on regular production lines of metal matrix. The printed circuit boards with embedded ceramic chip has high cost performance, wide application potential, has a heat conduction coefficient of 170 W/m.k, and a voltage proof value of 6000 V AC.

Description

technical field [0001] The invention relates to the field of automobile indicator lights, in particular to a method for manufacturing a metal-based printed circuit board embedded with ceramic sheets. Background technique [0002] The names of circuit boards are: circuit board, PCB board, aluminum substrate, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards can be called printed circuit boards or printed circuit boards. Printed circuit boards are the most active industry in the contemporary electronic component industry, and their industry growth rate is generally about three percentage points higher than that of the electronic component industry. It is expected that the rapid growth ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0061H05K2201/017
Inventor 张飞龙王远
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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