Method for manufacturing metal matrix printed circuit board embedded with ceramic chip
A technology of printed circuit boards and production methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit dielectrics, etc., can solve the problems of high cost, low withstand voltage, and the inability to share printed circuit board production lines, etc., to achieve accurate production, High thermal conductivity, cost-effective effect
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[0028] The following clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] The present invention will be further explained below in conjunction with some examples. It should be understood that the following examples are intended to illustrate and should not be regarded as limiting the present invention.
[0030] A method for manufacturing a metal-based printed circuit board embedded with ceramic sheets, comprising:
[0031] Step 1: Put the ceramic sheet into the hole of the metal base;
[0032] Step 2: Cover the RCC, put the RCC with the protective film off on the metal substrate where the ceramic ...
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