An array substrate detection method and detection system
An array substrate and detection method technology, which is applied in the field of array substrate detection methods and detection systems, can solve the problem of being unable to accurately locate the specific position of a metal wire short circuit on an array substrate, and achieve the effect of improving the success rate of defective detection
Active Publication Date: 2019-06-25
BOE TECH GRP CO LTD
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Aiming at the defects of the prior art, the present invention provides an array substrate inspection method and inspection system, which can solve the problem that the array substrate inspection equipment in the prior art cannot precisely locate the specific position where the short circuit of the metal line on the array substrate occurs
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0052] figure 1 is an array substrate detection method provided by an embodiment of the present invention, such as figure 1 As shown, the method includes the following steps:
[0053] S1: Detecting and acquiring short-circuited metal wires and the arrangement positions of the metal wires on the array substrate.
[0054]It should be noted that the metal lines can be gate lines, data lines, common electrode lines, etc. on the array substrate, and the short cir...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The embodiment of the invention provides a detection method and a detection system for an array substrate. The detection method comprises the following steps: carrying out detection to obtain short-circuited metal wires and the arranging positions of the metal wires on the array substrate; scanning the metal wires with a heat detection element; determining coordinate information of short-circuited parts on the metal wires. According to the detection method and the detection system, the positions of the short-circuited parts on the metal wires can be located precisely, so that the success rate of reject detection of the array substrate is increased; the short-circuited metal wires on the array substrate can be repaired conveniently based on the accurate positions of the short-circuited parts.
Description
technical field [0001] The present invention relates to the technical field of array substrate detection, in particular to an array substrate detection method and detection system. Background technique [0002] The design of OLED products is complex, and the yield rate is much lower than that of LCDs. The array substrate is a key component of OLED products. There are various metal wirings on the array substrate, such as gate lines and common electrode lines parallel to each other on the substrate, or interconnected Vertical gate lines and data lines, etc. [0003] At present, during the array test, the existing array substrate testing equipment can only locate the metal wiring where the short circuit occurs, but cannot locate the specific location where the line defect occurs. It is necessary to rely on additional testing CSI equipment to locate the location where the short circuit occurs Specifically, the CSI device is mainly based on the magnetic field generated by the DC...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13G02F1/1362
CPCG02F1/1309G02F1/1362G02F1/136254
Inventor 李永谦徐攀李全虎
Owner BOE TECH GRP CO LTD