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Electrical resistance test method and system

A testing method and testing system technology, applied in the field of material processing, can solve the problem of low accuracy

Active Publication Date: 2017-01-11
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since the resistance value between the via hole and the via hole is the sum of the resistance values ​​generated by all the insulating layers between the two via holes, and when there are many insulating layers, only a small amount of cation migration occurs in one insulating layer, the via hole The resistance value between the hole and the via hole has less influence, resulting in lower accuracy of the electrical resistance performance test of the PCB

Method used

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  • Electrical resistance test method and system

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specific Embodiment approach

[0054]Since the electrical resistance performance is generally carried out during the product verification of new boards, new processes or new structures, it is first necessary to produce PCB samples to be tested according to the newly proposed process. In order to guide the production of PCBs, another embodiment of the present invention Among them, the specific implementation manner of step 101 includes:

[0055] Setting specification parameters of at least two insulating layers, the specification parameters including: any one or more of layers, types of insulating materials, and thicknesses;

[0056] The PCB is a multi-layer structure, each layer includes an insulating layer composed of insulating materials and a conductive laminate composed of conductive materials. At the specific level of the PCB, for example, set the fifth layer of the PCB to be a resin material with a thickness of 8mil.

[0057] N1. Lay the current insulation layer at the laying position according to th...

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Abstract

The invention provides an electrical resistance test method and system. The electrical resistance test method comprises the steps that a printed circuit board to be tested is determined, and a corresponding conductive laminate signal line is deployed for each conductive laminate in the printed circuit board to be tested; at least one through hole is arranged for the printed circuit board to be tested; a corresponding through hole signal line is deployed for each through hole on the printed circuit board to be tested; and the resistance value between each conductive laminate and the through holes is tested through the conductive laminate signal lines and the through hole signal lines. Testing of the electrical resistance between the through holes and the conductive laminates in the printed circuit board can be realized.

Description

technical field [0001] The invention relates to the technical field of material processing, in particular to a method and system for testing electric resistance performance. Background technique [0002] With the continuous development of electronic products in the direction of multi-functionality, miniaturization, light weight, and high performance, the via hole density in the printed circuit board (Printed Circuit Board, PCB) is increasing, and the hole-to-hole or hole-to-conductor During the conduction process between stacked layers, cations such as copper ions often migrate to the insulating layer, and the migration of such cations will cause electrical short circuits or open circuits, directly affecting the use of PCBs. Therefore, when verifying new boards, new processes or new structure products, it is necessary to test the electrical resistance of PCB. [0003] At present, the two vias are mainly connected to the positive and negative poles of the power supply by man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/02
CPCG01R27/02
Inventor 孙龙史书汉
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD