Plasma-based processing system and operation method thereof

A technology for processing systems and plasma, applied to circuits, discharge tubes, electrical components, etc., can solve problems such as fluctuations in plasma distribution and uneven distribution of plasma

Inactive Publication Date: 2017-03-15
ADVANCED ION BEAM TECHNOLOGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Therefore, it is necessary to develop new systems and / or methods to improve the problems of uneven plasma distribution and fluctuations in plasma distribution in existing plasma-based treatment systems

Method used

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  • Plasma-based processing system and operation method thereof
  • Plasma-based processing system and operation method thereof
  • Plasma-based processing system and operation method thereof

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Embodiment Construction

[0076] A detailed description of the present invention will be discussed by means of the following examples, which are not intended to limit the scope of the present invention, but may be applicable in other applications. The illustrations reveal some details, it must be understood that the design details of the disclosed components may differ from those disclosed, except in cases where the features of the components are expressly limited.

[0077] The present invention mainly uses one or more absorption devices formed by electrical conductors, on the way that plasma is transported from the plasma generation space inside the plasma reaction chamber to the workpiece (or the support structure used to carry the workpiece) Absorb part of the plasma to adjust the distribution of the transmitted plasma. In particular, by changing the configuration of the absorbing device between the plasma generating space and the workpiece (or support structure), the absorbing / adjusting effect of t...

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Abstract

A plasma-based processing system and a corresponding operation method are proposed. One or more absorbers are positioned between a plasma generation volume inside the plasma chamber and a support structure configured to support the workpiece, and then a portion of plasma delivered from the plasma generation volume to the support structure (or the workpiece) is absorbed by the absorber(s). Further, the absorber(s) are made of electrical conductive material(s), and the structure of at least one absorber and / or the relative geometric relation between at least two absorbers is adjustable. Hence, the position(s) of the electric conductor(s) overlap(s) with the delivered plasma may be adjusted, and then the ion current distribution on the cross section of the delivered plasma may be modified correspondingly.

Description

technical field [0001] The present invention relates to plasma-based treatment systems and methods of operation thereof, and in particular to the use of at least one absorber formed of an electrical conductor whose structure and / or relative position can be adjusted to adjust the amount of material transported to the workpiece and and / or plasma cross-sectional ion current distribution of the support structure. Background technique [0002] The plasma-based processing system (plasma-based processing system) and its operation method are an important link in the modern high-tech industry, whether it is applied to the manufacture of integrated circuit components, liquid crystal panels, light-emitting diodes, memory or others. The application of the plasma-based treatment system and its operation method at least includes but is not limited to converting the surface layer of the workpiece (workpiece) from crystalline material to amorphous material, removing certain materials from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32422H01J37/32715H01J2237/3321H01J2237/334H01J37/32798
Inventor 林伟政河合帕克·洋子盛天予
Owner ADVANCED ION BEAM TECHNOLOGY INC
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