The invention provides an adjusting structure applied to an HDP top
shower head, and belongs to the technical field of
semiconductor equipment, the adjusting structure comprises a
machine table, a plurality of side nozzles, the top
shower head and a
shower head lifting device, the surface of the
machine table is provided with a round hole, the lower surface of the
machine table is fixedly connected with a connector, the inner wall of the connector is fixedly communicated with the side nozzles, and the side nozzles are fixedly connected with the shower head lifting device. The top shower head is located in the machine table, the shower head lifting device is located on the machine table, and the shower head lifting device comprises a connecting cavity. According to the invention, the height of the top shower head can be adjusted, so that the top shower head can move up and down according to different processes to change the distribution of reaction gas; according to different gas flow processes, the position of the top shower head can be adjusted to find the most appropriate matching position with the side
nozzle, so that the gas reaction on the surface of the
wafer is more uniform, the
wafer thickness uniformity is finally optimized, and the problem that the uniformity of a large-flow gas process cannot meet the requirements of customers is solved.