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Substrate support with improved rf return

A substrate support, substrate technology, used in electrical components, semiconductor devices, electrical solid devices and other directions

Active Publication Date: 2019-12-13
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inventors have observed that thermocouples and AC power lines in the path of the RF return path are adversely affected by RF noise

Method used

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  • Substrate support with improved rf return
  • Substrate support with improved rf return
  • Substrate support with improved rf return

Examples

Experimental program
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Embodiment Construction

[0013] An apparatus for processing a substrate is disclosed herein. Embodiments of the inventive apparatus can advantageously shorten the RF current ground path and prevent distortion of temperature measurements produced by thermocouples or other temperature monitoring devices present in the substrate support.

[0014] The following description will refer to figure 1 and 2 . figure 1 Shown is a schematic diagram of a substrate processing system according to some embodiments of the present disclosure. figure 2 draw figure 1 A partial schematic of the substrate processing system. For example, the substrate processing system 100 may include a processing chamber 102 having a processing volume 104 , and a substrate support 106 disposed in the processing volume 104 for supporting a substrate 105 . The processing chamber 102 may include walls formed from a conductive material such as aluminum (Al) or the like. In some embodiments, for example, when the processing chamber 102 i...

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PUM

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Abstract

Provided herein is an apparatus for processing a substrate. In some embodiments, a substrate support includes a body having a support surface; RF electrodes disposed in the body near the support surface to receive RF current from an RF source; a shaft for supporting the body; having an interior space and extending through a conductive element of the shaft, wherein the conductive element is coupled to the RF electrode; and an RF pad; wherein the conductive element includes a feature that engages the RF pad to return the RF current to ground.

Description

technical field [0001] Embodiments of the present disclosure relate generally to substrate processing systems, and more particularly to substrate supports for use in substrate processing systems. Background technique [0002] Substrate processing equipment typically includes a substrate support that supports a substrate during processing. The substrate support may include radio frequency (RF) electrodes disposed near the substrate processing surface to receive RF current from an RF source. For example, the RF electrode can be returned as RF to ground, or have an RF source coupled to the RF electrode. The RF electrodes may be coupled to rods, wires or the like to provide RF current to the RF electrodes or return RF current to ground. The substrate support may further include a heater disposed near the substrate processing surface to heat the substrate when the substrate is disposed on the substrate processing surface. However, the inventors have observed that thermocouples...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32H01L21/67H01L21/687
CPCH01J37/32082H01J37/32532H01J37/32724H01L21/67103H01L21/67248H01L21/68792H01L2221/67H01L2221/683
Inventor 阿拉维德·米亚尔·卡马斯蔡振雄贾勒帕里·拉维松下智治雨·常
Owner APPLIED MATERIALS INC