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Resin molding apparatus and resin molding method

A resin molding and resin technology, applied in the field of resin molding devices, can solve the problems of residual resin scattering, pollution, and excessive time.

Inactive Publication Date: 2017-10-31
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it takes a lot of time until the liquid resin is supplied to the injection target.
In addition, there is a possibility that residual resin may scatter due to the flow of air or may be contaminated by residual resin adhering to other drive mechanisms or structural parts, etc.

Method used

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  • Resin molding apparatus and resin molding method
  • Resin molding apparatus and resin molding method
  • Resin molding apparatus and resin molding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0045] (Structure of resin molding equipment)

[0046] Reference figure 1 The structure of the resin molding apparatus of the present invention will be described. figure 1 The resin molding apparatus 1 shown is a resin molding apparatus using a compression molding method. An example in which liquid resin that is a fluid resin is used as the resin material is shown.

[0047] The resin molding apparatus 1 includes a substrate supply storage module 2, three molding modules 3A, 3B, 3C, and a resin supply module 4 as constituent elements, respectively. The substrate supply storage module 2, the molding modules 3A, 3B, 3C, and the resin supply module 4, which are structural elements, can be attached to and detached from each other with respect to other structural elements, and can be replaced.

[0048] The substrate supply and storage module 2 is provided with: a pre-packaged substrate supply part 6, which supplies the pre-packaged substrate 5; a post-package substrate accommodating par...

Embodiment approach 2

[0112] (Structure of resin removal mechanism)

[0113] Reference Figure 5 Next, another form of the resin removing mechanism used in the resin molding apparatus 1 will be described. The difference from Embodiment 1 is that a rotating body is used as a member for removing the residual resin 30 instead of a film-shaped member as a member for removing the residual resin 30. Since the structure other than the resin removing mechanism is completely the same as that of the first embodiment, the description is omitted.

[0114] Such as Figure 5 As shown, the resin removal mechanism 35 includes: a rotating body 36 for attaching and winding the residual resin 30; a rotating mechanism 37 (the part shown by a dotted line in the figure) for rotating the rotating body 36; and a container 38 for storing the residual resin Resin 30. As the rotating body 36, for example, a rotating body having a circular cross-sectional shape can be used. The storage container 38 is provided with a scraper-sh...

Embodiment approach 3

[0134] (Structure of hose for resin injection)

[0135] Reference Figure 7 The resin injection hose used in the dispenser 18 as the resin injection mechanism will be described.

[0136] Such as Figure 7 As shown, an elastically deformable hose 40 is provided on the lower surface of the resin injection portion 20 of the dispenser 18 via a joint (not shown). The liquid resin is sprayed downward from the tip of the hose 40. The hose 40 is attachable to and detachable from the resin injection part 20 via a joint, and the hose 40 can be replaced. The hose 40 having a different inner diameter or shape can be selected and used in accordance with the product or application. As the hose 40, for example, a hose formed of silicone rubber or the like can be used. The hose 40 may be a material that can be elastically deformed.

[0137] A clamping mechanism 41 that squeezes the flow path of the hose 40 is provided around the hose 40. The flow path of the hose 40 can be narrowed by the clamp...

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Abstract

The invention provides a resin molding apparatus and resin molding method, and aims to eliminate the state that residual resin sags and is left at an injection orifice of a resin injection mechanism in advance. A resin forming device has forming dies, at least one of an upper die and a lower die being provided with a cavity; a resin injection mechanism to supply a fluid resin to the cavity and inject the fluid resin to an injection object; a resin removing mechanism which is a residual state eliminating mechanism which forcibly eliminates the state that residual resin sags and is left at the injection orifice of the resin injection mechanism; and a clamping unit which performs clamping on the forming dies supplied with the fluid resin in the cavity. The resin removing mechanism includes a sending-out mechanism used for sending out a film-like component for attachment of residual resin; a reeling mechanism used for reeling the film-like component; and an arranging component used for arranging the film-like component in a removal position of the residual resin.

Description

Technical field [0001] The present invention relates to a resin encapsulation of chip-shaped electronic components (hereinafter, appropriately referred to as "chips") such as transistors, integrated circuits (IC) and light emitting diodes (Light Emitting Diode: LED) using liquid resin The resin molding equipment and resin molding method used in the case of In this application, the term "liquid" means that it is liquid and has fluidity at normal temperature, and does not involve the level of fluidity, in other words, the degree of viscosity. Background technique [0002] Conventionally, a liquid resin has been used to resin-encapsulate a semiconductor chip (molded product) mounted on a substrate. In a resin package using a liquid resin, a dispenser as a liquid resin ejection mechanism is used, and the liquid resin is ejected from a nozzle installed at the tip of the dispenser to a molded article (see Patent Document 1). And, as in Patent Document 1 image 3 As shown, a solution o...

Claims

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Application Information

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IPC IPC(8): B29C39/10B29C39/24B29C39/22B29C39/26H01L21/56B29L31/34
CPCB29C39/10B29C39/22B29C39/24B29C39/26B29L2031/34H01L21/565H01L2224/97H01L2924/181H01L2924/00012B29C31/048B29C31/06
Inventor 后藤智行水间敬太岩田康弘高田直毅花坂周邦
Owner TOWA
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