A host characterized by rapid heat dissipation

A main engine and fast technology, applied in the direction of supporting machines, mechanical equipment, machines/supports, etc., can solve the problem of limited heat dissipation area and area, achieve enhanced ventilation effect, ensure heat dissipation effect, and increase heat dissipation area and area Effect

Inactive Publication Date: 2017-11-03
肇庆高新区异星科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the heat dissipation mechanism in the computer mainframe is relatively simple in the prior art. Generally, the heat dissipation fan is fixed on the chassis shell, and the heat dissipation area and area are limited, and a fast heat dissipation mechanism is proposed. host

Method used

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  • A host characterized by rapid heat dissipation
  • A host characterized by rapid heat dissipation
  • A host characterized by rapid heat dissipation

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0018] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0019] refer to Figure ...

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Abstract

The invention discloses a host that can quickly dissipate heat, comprising a main box body, an installation groove is arranged on the inner top of the main box body, and a drive motor is fixedly connected to the inner side wall of the installation groove, and the output of the drive motor is A transmission rod is fixedly connected to the end, a sliding rod is fixedly connected in the installation groove, a supporting block is slidably sleeved on the sliding rod, and a plurality of electric fans are fixedly connected to the bottom of the supporting block, and the supporting block is close to the drive One side of the motor is provided with a strip groove, a slider is slidably connected in the strip groove, a push rod is fixedly connected to one side of the slider, and the end of the push rod away from the slider penetrates the groove of the strip groove The end of the push rod and the transmission rod are fixedly connected by a connecting rod. Through the arrangement of multiple transmission mechanisms, the invention enables the electric fan to move back and forth in the chassis to dissipate heat, thereby increasing the heat dissipation area and area of ​​the heat dissipation mechanism, thereby ensuring the heat dissipation effect of the host.

Description

technical field [0001] The invention relates to the technical field of computer peripherals, in particular to a host that can quickly dissipate heat. Background technique [0002] At present, in the host computer, the general device has a main board. Components such as power supplies and hard disks, among which chips embedded on the motherboard, will generate high temperature due to continuous high-frequency vibration after being activated for a period of time. In order to maintain the normal operation of the computer, a fan is generally installed on the heat source Wait for heat components to improve heat dissipation efficiency and maintain the normal operation of the computer. The computer radiator plays a very important role, especially in the hot summer. If the heat dissipation is not good, the computer will crash due to excessive temperature. However, the heat dissipation mechanism in the existing computer mainframe is relatively simple. Generally, the heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16M11/04G06F1/20G06F1/18
CPCF16M11/045G06F1/183G06F1/20
Inventor 陆伟明
Owner 肇庆高新区异星科技有限公司
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