Production process of diode

A production process and diode technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems that copper ions cannot be thoroughly cleaned, affect chip corrosion rate, product electrical degradation, etc. The effect of protecting, avoiding electrical degradation, and improving electrical yield

Inactive Publication Date: 2018-01-16
RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, diodes are soldered with chips, solder and leads at high temperature, and then acid-treated on the surface of the chips. However, during the pickling process, metal impurities in the solder and leads will react with the acid, affecting the corrosion rate of the chips. At the same time, The metal ions generated by the reaction of these metals with the acid will adhere to the surface of the chip, and a large amount of water and chemical reagents are requ

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The production process of the diode in this embodiment includes five processes of pickling, electroplating, welding, insulation protection and post-treatment, and the specific steps are as follows:

[0023] (1) Pickling: Place the diode chip in a mixed solution of sulfuric acid and phosphoric acid with a volume ratio of 1:2 for acid corrosion. The corrosion time is 10 minutes, and the acid temperature is controlled between 1 °C;

[0024] (2) Electroplating: The pickled diode chip is electroplated to form a metal protective layer on the surface of the diode chip, and the thickness of the coating is 5µm;

[0025] (3) Welding: Put the two metal lead electrodes, the soldering piece and the diode chip after electroplating into the jig, and send it to the welding furnace for three heating times. The first time the temperature is controlled at 270 ° C, the welding time is 5 minutes, the second The temperature is controlled at 280°C, and the welding time is 5 minutes. The third...

Embodiment 2

[0029] The production process of the diode in this embodiment includes five processes of pickling, electroplating, welding, insulation protection and post-treatment, and the specific steps are as follows:

[0030] (1) Pickling: Place the diode chip in a mixed solution of sulfuric acid and phosphoric acid with a volume ratio of 1:2 for acid corrosion. The corrosion time is 15 minutes, and the acid temperature is controlled between 5°C;

[0031] (2) Electroplating: The pickled diode chip is electroplated to form a metal protective layer on the surface of the diode chip, and the thickness of the coating is 3µm;

[0032] (3) Welding: Put the two metal lead electrodes, the soldering piece and the diode chip after electroplating into the jig, and send it to the welding furnace for three heating times. The temperature is controlled at 290°C, and the welding time is 4 minutes. The third temperature is controlled at 300°C, and the welding time is 4 minutes, so that the diode chip is co...

Embodiment 3

[0036] The production process of the diode in this embodiment includes five processes of pickling, electroplating, welding, insulation protection and post-treatment, and the specific steps are as follows:

[0037] (1) Pickling: Place the diode chip in a mixed solution of sulfuric acid and phosphoric acid with a volume ratio of 1:2 for acid corrosion. The corrosion time is 13 minutes, and the acid temperature is controlled between 3°C;

[0038] (2) Electroplating: The pickled diode chip is electroplated to form a metal protective layer on the surface of the diode chip, and the thickness of the coating is 4µm;

[0039] (3) Welding: Put the two metal lead electrodes, the soldering piece and the diode chip after electroplating into the jig, and send it to the welding furnace for three heating times. The second temperature is controlled at 285°C, and the welding time is 4.5 minutes. The third temperature is controlled at 295°C, and the welding time is 4.5 minutes, so that the diode...

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PUM

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Abstract

The invention relates to a production process of a diode. The production process comprises five procedures, namely, acid pickling, electroplating, welding, insulation protection and post-treatment. According to the production process of the diode of the invention, at first, acid pickling is performed, and then welding is performed; acid corrosion is performed on chips before welding is performed,so that metal impurities in solder and leads will not react with an acid solution during the acid pickling, so that the corrosion rate of the chips will not be affected; a condition that metal ions generated by the reaction of metal with acid are attached onto the surfaces of the chips can be avoided, and therefore, a lot of cleaning processes can be eliminated, and resources can be saved; a gradient heating welding mode is adopted, so that faults such as the electrical property attenuation of products and the thermal breakdown of the products under high temperature can be avoided, the electrical property yield of the products can be improved; and metal content in discharged cleaning fluid is low, so that pollution made to soil can be reduced, and therefore, environmental protection can befacilitated.

Description

technical field [0001] The invention relates to the technical field of diode production, in particular to a production of diodes [0002] craft. Background technique [0003] Diode is one of the most commonly used electronic components. The biggest characteristic is unidirectional conduction, that is, current can only flow from one direction of the diode. The function of the diode is a rectifier circuit, a detection circuit, a voltage regulator circuit, and various modulation circuits It is mainly composed of diodes. [0004] As diodes are widely used in the market, their demand is also increasing. At present, diodes are soldered with chips, solder and leads at high temperature, and then acid-treated on the surface of the chips. However, during the pickling process, metal impurities in the solder and leads will react with the acid, affecting the corrosion rate of the chips. At the same time, The metal ions generated by the reaction of these metals with the acid will adher...

Claims

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Application Information

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IPC IPC(8): H01L21/329H01L21/02H01L21/60
Inventor 曹建民
Owner RUGAO XIAYUAN SCI & TECH ESTABLISH A BUSINESS SERVICES CO LTD
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