Wafer production technology

Abstract

The invention relates to a wafer production process, which includes six processes of pickling, electroplating, welding, alkali cleaning, insulation protection and post-treatment. The advantages of the present invention are: the production process of the wafer of the present invention, first pickling, then soldering, then alkali cleaning, and finally insulation protection, the chip is acid-etched before soldering, avoiding the metal in the solder and lead wires during the pickling process. Impurities will react with acid and affect the corrosion rate of the chip; avoid the metal ions generated by the reaction of metal and acid from attaching to the surface of the chip, saving a lot of cleaning process and saving resources; avoid the electrical degradation of the product and thermal shock at high temperature Wear and other faults, improve the electrical yield of the product; at the same time, it also reduces the metal content in the discharged cleaning solution, reduces the pollution to the soil, and thus is conducive to environmental protection.

Description

technical field [0001] The invention relates to the technical field of wafer production, in particular to a wafer production process. Background technique [0002] As chips are widely used in the market, their demand is getting higher and higher. At present, chips are soldered with chips, solder and leads at high temperature, and then the chip surface is acid-treated. However, during the pickling process, the metal impurities in the solder and leads will react with the acid and affect the corrosion rate of the chips. At the same time, The metal ions generated by the reaction of these metals with the acid will adhere to the surface of the chip, and a large amount of water and chemical reagents are required to clean in the subsequent process; this kind of cleaning not only consumes a lot of resources, but also the copper ions attached to the surface of the chip cannot be thoroughly cleaned, and will It will cause the electrical degradation of the product and thermal breakdown...

AI Technical Summary

Problems solved by technology

At present, chips are soldered with chips, solder and leads at high temperature, and then the chip surface is acid-treated. However, during the pickling process, the metal impurities in the solder and leads will react with the acid and affect the corrosion rate of the chips. At the same time, The metal ions generated by the reaction of these metals with the acid will adhere to the surface of the chip, and a large amount of water and chemical reagents are required to clean in the subsequent process; this kind of cleaning not only consumes a lot of resources, but also the copper ions attached to the surface of the chip cannot be thoroughly cleaned, and will It will cause the electrical degradation of the product and thermal breakdown and other failures at high temperatures; in addition, it will also cause high metal content in the discharged cleaning solution, which will cause serious pollution to the soil after discharge; during welding, it will also cause inclusions in the chip Impurities and welding stress