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Wafer fixing device and application method thereof

A technology for fixing wafers and fixing grooves, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of wafer air ingress, wafer failure, adsorption, etc., and achieve the effect of improving the firmness and reliability of adsorption

Pending Publication Date: 2018-01-16
SKYVERSE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of wafer detection and processing, the wafer is usually placed on the rotating platform by using a fixed chuck for vacuum adsorption, and then the wafer is detected and processed piece by piece and point by point. However, in the process, the wafer The circle often shows a certain warpage, such as potato chip shape, saddle shape and other irregular distribution. When the warpage is large, air will enter the edge of the wafer, and the vacuum cavity cannot be formed, which will cause the wafer to be unable to be fixed on the chuck. Reliable adsorption, therefore, the problem of adsorption and fixation of wafers with large warpage is one of the problems to be solved in the design of fixed chucks

Method used

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  • Wafer fixing device and application method thereof
  • Wafer fixing device and application method thereof
  • Wafer fixing device and application method thereof

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Embodiment Construction

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0039] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0040] In the present in...

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Abstract

The invention discloses a wafer fixing device and an application method thereof. The wafer fixing device comprises a clamping disc, wherein the clamping disc comprises a first bearing surface, and arbitrary one or more of a vacuum pipeline, a vacuum hole and a sealing ring is further arranged on the clamping disc. The wafer fixing device disclosed by the technical scheme aims to improve vacuum absorption firmness of a large-warpage wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer fixing device and a using method thereof. Background technique [0002] A wafer refers to a silicon wafer of a semiconductor integrated circuit. Because of its circular shape, it is called a wafer. In the process of wafer detection and processing, the wafer is usually placed on the rotating platform by using a fixed chuck for vacuum adsorption, and then the wafer is detected and processed piece by piece and point by point. However, in the process, the wafer The circle often shows a certain warpage, such as potato chip shape, saddle shape and other irregular distribution. When the warpage is large, air will enter the edge of the wafer, and the vacuum cavity cannot be formed, which will cause the wafer to be unable to be fixed on the chuck. Reliable adsorption. Therefore, the problem of adsorption and fixation of large warpage wafers is one of the difficult problems...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
Inventor 陈鲁张朝前马砚忠李少雷
Owner SKYVERSE TECH CO LTD