Fluid process treatment device

Abstract

Provided is a fluid process processing device. The fluid process processing device comprises a device main body, a parameter acquisition module and a height adjusting module. The device main body comprises a substrate supporting unit and a liquid collection unit, the substrate supporting unit is used for supporting a substrate, the liquid collection unit is arranged around the substrate supportingunit, the parameter acquisition module is electrically connected with the device main body and acquires substrate parameters of the substrate, and the height adjusting module is electrically connected with the parameter acquisition module to adjust the height difference between the substrate supporting unit and the liquid collection unit according to the substrate parameters.

Description

Technical field [0001] The present invention relates to a fluid process processing device, and to a fluid process processing device that adjusts the height difference between a substrate carrying unit and a liquid collection unit according to substrate parameters to improve the recovery rate of processing liquid. Background technique [0002] Most semiconductor substrate processing devices use a lifting collection ring to collect the processing liquid of the semiconductor chip. The prior art uses a collection unit that includes a plurality of liquid collection rings, and the multiple liquid collection rings must be driven by a lifting mechanism to perform relative lifting actions. In order to collect different liquids, the specific liquid collecting ring can be raised and lowered in advance, so that the liquid is guided by each liquid collecting ring and discharged from the drain pipe below each collecting ring. [0003] However, with the rapid development of technology, in order t...

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Problems solved by technology

[0003] However, with the rapid development of science and technology, in order to adapt to different processes or packaging applications, the types of semiconductor chips are gradually diversified. However, the processing devices for semiconductor substrates currently used have not been developed to adjust semiconductor processing devices for different types of semiconductor chips. The technology of the height of the inner liquid collection ring only has a fixed lifting height of each collection ring, which causes the processing device to be unable to accurately handle different types of semiconductor chips, which reduces the recovery rate of the processing liquid of the semiconductor chip, so there is a need for improvement

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