Liquid-cooled cooling system

Abstract

The invention discloses a liquid-cooling type heat dissipation system. The liquid-cooling type heat dissipation system comprises a liquid-cooling row, a liquid-cooling head, at least one flow pipe andat least one metal layer, wherein the liquid-cooling head is in thermal contact with at least one heat source; the flow pipe is connected between the liquid-cooling head and the liquid-cooling row; and the metal layer covers the inner pipe wall and / or the outer pipe wall of the at least one flow pipe. By virtue of the design of covering the internal or the external of the flow pipe with the corresponding metal layer, a condition that a cooling liquid is evaporated and dissipated to the outside can be lowered, so as to avoid increasing of flow resistance caused by air entry to the flow pipe inair replacement, and to further maintain the heat dissimilation efficiency of the heat dissipation system.

Description

technical field [0001] The invention relates to a liquid-cooled heat dissipation system, in particular to a liquid-cooled heat dissipation system suitable for heat dissipation of electronic devices. Background technique [0002] Many high-power electronic components, such as central processing units or image processors, are installed in existing electronic devices. These electronic components have excellent data processing performance, but they will generate astonishing heat energy during operation. If there is no proper heat dissipation mechanism to remove the heat energy, the heat energy will make these electronic components exceed their safe operating temperature and reduce the operating performance. Even make the entire Electronics die from overheating. [0003] With the advancement of heat dissipation technology, the liquid cooling heat dissipation system has gradually become one of the mainstreams for heat dissipation of electronic devices. The so-called liquid-coole...

AI Technical Summary

Problems solved by technology

In the process of cooling liquid evaporating outward, the internal pressure of the flow tube will drop, so that the smaller gas molecules in the external air, such as helium, will dissolve in the cooling tube through the flow tube material while the cooling liquid is evaporating. When the liquid is dissolved and saturated, the air will exist in the circulation in the form of bubbles, but these bubbles will increase the flow resistance of the circulation and affect the heat dissipation performance

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