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Strain and crack decoupling measurement device and method based on binary patch antenna array

A patch antenna and measuring device technology, which is applied in measuring devices, electromagnetic measuring devices, electric/magnetic solid deformation measurement, etc., can solve problems such as difficult to accurately measure the surface stress and crack parameters of metal structures, and overcome the measurement of strain and cracks Coupling effects, overcoming wiring difficulties, and ensuring accuracy

Inactive Publication Date: 2018-03-02
WUHAN UNIV OF TECH
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a strain and crack decoupling measurement device and method based on a bina

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  • Strain and crack decoupling measurement device and method based on binary patch antenna array
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  • Strain and crack decoupling measurement device and method based on binary patch antenna array

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] Such as figure 1 As shown, the strain and crack decoupling measurement device based on the binary patch antenna array of the embodiment of the present invention includes a compensation antenna 1, a measurement antenna 2 and a wireless interrogation device 3, and the compensation antenna 1 and the measurement antenna 2 are two There are four rectangular patch antennas with different structures and sizes, the compensation antenna 1 and the measurement antenna 2 are pasted on the surface of the structure to be tested respectively; Antenna 1 and measuring antenna 2 emit frequency-sweeping elect...

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Abstract

The invention discloses a strain and crack decoupling measurement device and method based on a binary patch antenna array. The method comprises steps that S1, a compensation antenna and a measurementantenna are respectively attached to the surface of a to-be-tested structure; S2, frequency sweep electromagnetic waves are transmitted by a wireless inquirer device to the compensation antenna and the measurement antenna in real time, and the resonant frequency is respectively acquired according to reflected signals; S3, when a crack is generated on the surface of the to-be-tested structure, a ground floor of the compensation antenna isolates influence of the surface crack of the to-be-tested structure on the resonant frequency, only strain is sensed, and the comprehensive strain and crack information is sensed by the measurement antenna; according to the real-time resonant frequency of the compensation antenna and measurement antenna, in combination with length and the initial resonant frequency, strain and crack information decoupling are realized. The method is advantaged in that decoupling and accurate measurement of the surface strain and crack information of the metal structureare realized through utilizing the patch antenna, the device structure is simple, and lead connection is not needed.

Description

technical field [0001] The invention relates to the field of strain and crack measurement of metal structures, in particular to a strain and crack decoupling measurement device and method based on a binary patch antenna array. Background technique [0002] Common metal structure health monitoring sensors include foil strain gauges, fiber optic sensors, ultrasonic sensors, etc. These sensors can meet the needs of engineering applications to a certain extent, but there are also disadvantages such as cable connections, high cost, and complicated devices. In recent years, scholars at home and abroad have proposed the use of microstrip patch antennas in the field of strain and crack measurement of metal structures. The microstrip patch antenna has the characteristics of simple structure, light weight, low production cost, passive wireless interrogation, and easy conformity with curved surfaces. It can effectively overcome the shortcomings of the above-mentioned sensors and has a ...

Claims

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Application Information

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IPC IPC(8): G01B7/00G01B7/16G01B7/02
CPCG01B7/00G01B7/02G01B7/16
Inventor 刘志平柯亮
Owner WUHAN UNIV OF TECH
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