All-quartz crystal oscillator with improved package structure and preparation method thereof

Abstract

The invention discloses an all-quartz crystal oscillator with an improved package structure and a preparation method thereof, the all-quartz crystal oscillator with the improved package structure comprises a quartz wafer, a package cover and a package pedestal, the quartz wafer comprises a protection frame, the upper surface of the protection frame is provided with a package metal layer A, a package metal layer B is arranged outside a projection of the package metal layer A on the lower surface of the protection frame, a package metal layer C is arranged on a region, directly facing the package metal layer A, of the package cover, and a package metal layer D is arranged on a region, directly facing the package metal layer B, of the package pedestal; the projection of the package metal layer A and the projection of the package metal layer B are not overlapped mutually on the quartz wafer, thus, generation of parasitic capacitance can be prevented effectively; and instead of a glass solder or a resin solder, a metal is used for packaging, vacuum degree of products can be improved.

Description

technical field [0001] The invention relates to the technical field of quartz crystal resonators, in particular to an all-quartz crystal resonator with an improved packaging structure and a preparation method thereof. Background technique [0002] Quartz crystal resonators are usually composed of piezoelectric quartz wafers and packaging shells, wherein the piezoelectric quartz wafers are rectangular or circular, and the packaging shell materials are ceramics, glass, metal, etc. Electrodes are vapor-deposited on the upper and lower sides of the piezoelectric quartz wafer, and are fixed in the packaging shell by conductive glue. The electrodes are connected to the base pins of the packaging shell through the leads of the sealed package. The AC voltage is connected to the upper and lower electrodes of the quartz wafer through the pins, causing the quartz wafer to produce an inverse piezoelectric effect, thereby generating oscillation. [0003] With the rapid development of mo...

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Problems solved by technology

[0006] The purpose of the present invention is to provide an all-quartz crystal resonator with an improved packaging structure, which solves the technical problems of using traditional metal packaging structures to generate parasitic capacitance and adopting new packaging structures to generate gas that affects the vacuum degree of products

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