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Undeformed chip maximum thickness prediction method in grinding machining

A maximum thickness, grinding technology, applied in the field of mechanical parts processing, can solve problems such as difficult to determine, can not reflect the characteristics of random distribution of abrasive particles, etc.

Active Publication Date: 2018-04-24
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above assumptions cannot reflect the random distribution of abrasive particles, and B, L and r in the formula are difficult to determine

Method used

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  • Undeformed chip maximum thickness prediction method in grinding machining
  • Undeformed chip maximum thickness prediction method in grinding machining
  • Undeformed chip maximum thickness prediction method in grinding machining

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Embodiment Construction

[0039] The method for predicting the maximum thickness of undeformed chips in the grinding process of the present invention comprises the following steps:

[0040] a. Obtain the geometric parameters and motion parameters of the grinding wheel for grinding; the geometric parameters include the diameter of the grinding wheel, the geometric data of the abrasive grains and other shape parameters that have an impact on the grinding process, and the motion parameters include speed and other motions that have an impact on the grinding process parameter;

[0041] b. Obtain the geometric parameters and motion parameters of the ground surface of the workpiece. The geometric parameters include the shape parameters that have an impact on the grinding process such as the diameter of the workpiece surface and the depth to be ground, and the motion parameters include speed and other motions that have an impact on the grinding process. parameter;

[0042] c Maximum undeformed chip thickness ...

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Abstract

The present invention provides an undeformed chip maximum thickness prediction method in grinding machining. Through obtaining working surface geometrical parameters and motion parameters of a grinding wheel and obtaining grinded surface geometrical parameters and motion parameters of a workpiece, the undeformed chip maximum thickness in the grinding machining is finally predicted. The surface parameters and the motion parameters of the grinding wheel are obtained, the technical problems that in the prior art, all abrasive particles are assumed to be spherical and have the same size, and the abrasive particles are uniformly distributed on the grinding wheel surface and have the same protrusion height are eliminated, random distribution characteristics of the abrasive particles can be reflected by the final result, the undeformed chip maximum thickness under different grinding parameters and grinding wheel finishing parameters can be accurately predicted, and therefore theoretical basisis provided for selection of the grinding parameters and grinding wheel finishing parameters.

Description

technical field [0001] The invention relates to the field of machining of mechanical parts, in particular to a method for predicting the maximum thickness of undeformed chips in grinding. Background technique [0002] Grinding refers to the processing method of removing excess material on the workpiece with abrasives and abrasive tools; Grinding is one of the most widely used cutting processing methods with high precision, with less processing volume and high precision. In the grinding process, the abrasive grain penetration depth h, also known as the undeformed chip thickness, is an extremely important variable in the grinding process. The thickness of undeformed chips is closely related to the grinding force, grinding heat, and surface roughness of the workpiece after grinding. The study of the maximum thickness of undeformed chips can be used to predict the grinding force, grinding heat, and post-grinding. Surface roughness provides theoretical support. Therefore, it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B49/00
CPCB24B49/00B24B49/006
Inventor 刘宗敏唐倩宋军王时龙郭伏雨刘威
Owner CHONGQING UNIV