A Multidisciplinary Modeling and Design Methodology for Multi-Channel Chip TR Modules

A modeling method and design method technology, applied in the field of multidisciplinary modeling and design of multi-channel chip TR components, to achieve accurate design, collaborative design, and solve the effects of high heat consumption

Active Publication Date: 2021-07-23
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] One of the technical problems to be solved by the present invention is to provide a multi-disciplinary unified modeling method for multi-channel slice TR components for the problem that no clear multidisciplinary collaborative design method has been seen so far; the technical problems to be solved by the present invention The second is to provide a thermoelectric co-simulation design method based on the multi-disciplinary unified digital model of TR components to solve the problem that no clear multi-disciplinary collaborative design method has been seen so far, so as to realize the rapid and accurate evaluation of the thermal and electrical performance of multi-channel chip TR components. accurate co-design

Method used

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  • A Multidisciplinary Modeling and Design Methodology for Multi-Channel Chip TR Modules
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  • A Multidisciplinary Modeling and Design Methodology for Multi-Channel Chip TR Modules

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Embodiment 1

[0040] Embodiment A multidisciplinary design method for four-channel chip TR components

[0041] like figure 2 As shown, a multidisciplinary design approach for a four-channel chip TR assembly includes the following steps:

[0042] S1. Using the feature modeling method to quickly establish a multi-disciplinary unified digital model of multi-channel chip TR components

[0043] Customize and develop the passive circuit characteristic digital model of telecommunications professional in the structural professional digital model software (such as proE), establish the multidisciplinary unified digital model of TR components, and use it for thermoelectric synergy analysis. The passive circuit characteristic digital model includes multiple Multi-layer dielectric plate transmission line characteristic digital simulation and multi-layer dielectric board via hole characteristic digital simulation.

[0044] The multi-layer dielectric board circuit in the TR module includes the RF trans...

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Abstract

The invention discloses a multi-disciplinary modeling method for a multi-channel chip TR component. The feature modeling method is used to customize and develop the characteristic digital model of the passive circuit of the telecommunications professional in the structural professional digital model software, and establish a multidisciplinary unified digital model of the TR component. The model can be modified synchronously by modifying the model parameters, which is convenient for optimal design, and the multidisciplinary unified digital model itself can realize the sharing and transmission of thermoelectric co-simulation data, which is the basis of multidisciplinary design of TR components; the invention also discloses a method based on The multi-disciplinary digital-analog design method of multi-channel chip TR modules can effectively solve the design difficulties of high-density integrated TR modules that have a close influence on electrical performance due to high heat consumption, and realize rapid and accurate collaborative design of thermal and electrical performance of TR modules.

Description

technical field [0001] The invention relates to the design field of TR components of high-density integrated active phased array radar, and more specifically relates to a multidisciplinary modeling and design method of multi-channel chip TR components. Background technique [0002] TR components are the core of Active Phased Array Radar (AESA), and there are thousands to tens of thousands of TR components in an AESA. The new weapon equipment radar system puts forward an urgent demand for multi-channel chip TR components. This chip TR component has the characteristics of small unit volume, large number of internal active chips, and high-density integration between components, which makes its heat dissipation during operation The control problem is becoming more and more prominent, mainly manifested in: (1), multiple active chips on each signal channel of a single T / R component will generate intensive heat; (2), high-density integration of multiple chips in a small space T / R ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): G06F30/20G06F30/17G06F119/08
CPCG06F30/20
Inventor张平王梅胡子翔杨静吴文志于鹏飞
OwnerCHINA ELECTRONIC TECH GRP CORP NO 38 RES INST