Film forming method, display substrate and manufacturing method thereof, display device
A film-forming method and display substrate technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of limiting the efficiency, light color and lifespan of display devices, easily producing coffee rings, and uneven film morphology
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[0036] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.
[0037] The embodiments of the present invention aim at the fact that most of the ink solutes used in printing display devices in the prior art are π-conjugated compounds, which are easy to gather due to π-π stacking, resulting in an increase in the surface roughness of the formed thin film functional layer, which seriously limits the display. To solve the problem of improving device efficiency, light color, and lifespan, a film forming method, a display substrate and its manufacturing method, and a display device are provided, which can improve the film morphology of the printed film, thereby improving the performance of the display device.
[0038] The embodiment of the present invention provides a film forming method, comprising:
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