Open-type thermal buffering device and method

Abstract

The invention discloses an open-type thermal buffering device and method. The open-type thermal buffering method comprises the steps that materials with anisotropic thermal diffusivity are subjected to stretching and transformation; and the stretched plate-type materials are subjected to annular deformation, and thermal diffusivity after the coordinate of the plate-type materials is transformed isobtained. According to the open-type thermal buffering device and method thereof, acute change of the exterior temperature can be smoothed, the average temperature of the outside world is quickly achieved, and the open-type thermal buffering device is not isolated with the outside world and can communicate with the outside world; and the open-type thermal buffering device is a passive device, energy saving and environmental protection are achieved, both thermal sources and cold sources are taken from the external environment, and the open-type thermal buffering device and method can be widelyapplied to the condition that periodic thermal pulses ate converted into uniform thermal flow.

Description

technical field [0001] The invention belongs to the field of light conversion, and more specifically relates to a thermal buffer device with an opening structure. Background technique [0002] Thermal buffering is generally used in situations where there is a large change in the surrounding temperature. An ideal thermal buffering device can absorb heat when the temperature is high to ensure that the internal space avoids excessively high temperatures, and release heat to the internal space when the temperature is low. The space provides the necessary temperature. The inner space is the area where we want to avoid the influence of extreme temperature, usually indoors or in various boxes. [0003] At present, there are two ways to provide a relatively stable temperature indoors or in the box. One is to use active equipment, such as air conditioners, to artificially regulate the internal temperature. The other is to use thermal insulation materials so that the internal temper...

AI Technical Summary

Problems solved by technology

[0007] The invention provides a novel thermal buffer technology for an open thermal buffer device and its manufacturing method, thereby solving the problems of high energy consumption, isolation from the outside world, and being easily affected by holes in the existing thermal buffer technology

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