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Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic EL display device manufacturing method

A substrate and mounting technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, electrical components, etc., can solve problems such as the inability to remove substrate deformation, achieve the effect of shortening the time required for alignment and reducing the number of alignment actions

Active Publication Date: 2018-10-09
CANON TOKKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in Patent Document 1, since the substrate is pressed only by the substrate-mask bonding unit, the deformation of the substrate itself cannot be removed.

Method used

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  • Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic EL display device manufacturing method
  • Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic EL display device manufacturing method
  • Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic EL display device manufacturing method

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Embodiment approach 1

[0082] Next, refer to Figure 5 , Embodiment 1 of the substrate mounting method of the present invention will be described.

[0083] The substrate mounting method of the present invention is a clamping method for clamping the conveyed substrate 10 and placing it on the mask 220, and includes a clamping step of clamping the substrate 10 ( Figure 5 (A), (B)), and the placing process of placing the clamped substrate 10 on the mask 220 ( Figure 5 (C), (D)).

[0084] In the placing step, one end of the supported substrate 10 is brought into contact with the mask 220 , and then the other end of the substrate 10 is brought into contact with the mask 220 to place the substrate 10 on the mask 220 .

[0085] [Clamping process]

[0086] Figure 5 (A) shows the state where the conveyed board|substrate 10 is received.

[0087] That is, the substrate 10 is delivered by a transfer robot (not shown) in a state where the first clamp mechanism 310L and the second clamp mechanism 310R are...

Embodiment approach 2

[0101] Next, refer to Image 6 , Embodiment 2 of the substrate mounting method of the present invention will be described.

[0102] In this second embodiment, the timing at which the clamping force of the second clamping mechanism 310R is such that the clamping position of the clamped substrate 10 can move is set between the portion of the substrate 10 that bends downward and the clamping force. Mask 220 before contact.

[0103] Clamping process

[0104] about Image 6 (A) shows the state of accepting the substrate 10 conveyed, because it is the same as Figure 5 (A) is the same, so description is omitted.

[0105] Image 6 (B) shows a state where the long sides of both sides of the substrate 10 are clamped by the first clamping mechanism 310L and the second clamping mechanism 310R. This clamping operation drives the clamp Z actuators 251 of the first clamping mechanism 310L and the second clamping mechanism 310R, and moves the plurality of pressing members 302 toward th...

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Abstract

The invention provides a substrate mounting method and mechanism, a film forming method and device, an electronic device manufacturing method, and an organic EL display device manufacturing method, for removing deformation of a substrate, generated when the substrate which is bended because of dead load is arranged on a mounting body. The substrate mounting method includes a support process of supporting the periphery of a substrate (10) and a mounting process of mounting the supported substrate (10) on a mask (220), wherein the mounting process enables one end side of the supported substrate(10) to contact the mask (220) and enables the other end of the substrate (10) to contact the mask (220) to mount the substrate (10) on the mask (220).

Description

technical field [0001] The present invention relates to a substrate mounting method, a mounting mechanism, a film forming method, a film forming apparatus, a method of manufacturing an electronic device, and a method of manufacturing an organic EL display device when forming a film on a substrate. Background technique [0002] Conventionally, when manufacturing electronic devices, the peripheral portion of a substrate transported into a vacuum chamber is clamped by a plurality of clampers, and the clamped substrate is lowered and placed on a mask (carrier), A predetermined pattern formed on a mask is deposited on a substrate by vapor deposition. [0003] The substrate is placed in the relationship of the film formation area in the central part of the substrate, and the peripheral part (for example, a pair of facing edge parts) of the substrate is clamped by the clamp, and the central part of the substrate is in a state of bending downward due to its own weight. When descend...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/50C23C14/04C23C14/24
CPCC23C14/042C23C14/24C23C14/50H01L21/02631H01L21/683H10K71/16H10K71/00
Inventor 石井博
Owner CANON TOKKI CORP