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Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic el display device manufacturing method

A manufacturing method and substrate technology, which are used in semiconductor/solid-state device manufacturing, electrical solid-state devices, electrical components, etc., can solve the problem of inability to remove substrate deformation, and achieve the effect of shortening the time required for alignment and reducing the number of alignment operations.

Active Publication Date: 2020-09-25
CANON TOKKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in Patent Document 1, since the substrate is pressed only by the substrate-mask bonding unit, the deformation of the substrate itself cannot be removed.

Method used

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  • Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic el display device manufacturing method
  • Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic el display device manufacturing method
  • Substrate mounting method and mechanism, film forming method and device, electronic device manufacturing method, and organic el display device manufacturing method

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Experimental program
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Embodiment approach 1

[0082] Next, refer to Figure 5 , Embodiment 1 of the substrate mounting method of the present invention will be described.

[0083] The substrate mounting method of the present invention is a clamping method for clamping the conveyed substrate 10 and placing it on the mask 220, and includes a clamping step of clamping the substrate 10 ( Figure 5 (A), (B)), and the placing process of placing the clamped substrate 10 on the mask 220 ( Figure 5 (C), (D)).

[0084] In the placing step, one end of the supported substrate 10 is brought into contact with the mask 220 , and then the other end of the substrate 10 is brought into contact with the mask 220 to place the substrate 10 on the mask 220 .

[0085] [Clamping process]

[0086] Figure 5 (A) shows the state where the conveyed board|substrate 10 is received.

[0087] That is, the substrate 10 is delivered by a transfer robot (not shown) in a state where the first clamp mechanism 310L and the second clamp mechanism 310R are...

Embodiment approach 2

[0101] Next, refer to Image 6 , Embodiment 2 of the substrate mounting method of the present invention will be described.

[0102] In this second embodiment, the timing at which the clamping force of the second clamping mechanism 310R is such that the clamping position of the clamped substrate 10 can move is set between the portion of the substrate 10 that bends downward and the clamping force. Mask 220 before contact.

[0103] Clamping process

[0104] about Image 6 (A) shows the state of accepting the substrate 10 conveyed, because it is the same as Figure 5 (A) is the same, so description is omitted.

[0105] Image 6 (B) shows a state where the long sides of both sides of the substrate 10 are clamped by the first clamping mechanism 310L and the second clamping mechanism 310R. This clamping operation drives the clamp Z actuators 251 of the first clamping mechanism 310L and the second clamping mechanism 310R, and moves the plurality of pressing members 302 toward th...

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Abstract

The present invention provides a method and mechanism for placing a substrate, a method and device for forming a film, a method for manufacturing an electronic device, and a method for manufacturing an organic EL display device, and removes the substrate that occurs when the substrate is placed on a carrier in a state of bending due to its own weight deformation. The substrate placing method includes: a supporting step of supporting the periphery of the substrate (10); and a placing step of placing the supported substrate (10) on the mask (220), wherein the supported substrate ( One end of the substrate (10) is in contact with the mask (220), and then the other end of the substrate (10) is brought into contact with the mask (220), and the substrate (10) is placed on the mask (220).

Description

technical field [0001] The present invention relates to a substrate mounting method, a mounting mechanism, a film forming method, a film forming apparatus, a method of manufacturing an electronic device, and a method of manufacturing an organic EL display device when forming a film on a substrate. Background technique [0002] Conventionally, when manufacturing electronic devices, the peripheral portion of a substrate transported into a vacuum chamber is clamped by a plurality of clampers, and the clamped substrate is lowered and placed on a mask (carrier), A predetermined pattern formed on a mask is deposited on a substrate by vapor deposition. [0003] The substrate is placed in the relationship of the film formation area in the central part of the substrate, and the peripheral part (for example, a pair of facing edge parts) of the substrate is clamped by the clamp, and the central part of the substrate is in a state of bending downward due to its own weight. When descend...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50C23C14/04C23C14/24
CPCC23C14/042C23C14/24C23C14/50H01L21/02631H01L21/683H10K71/16H10K71/00
Inventor 石井博
Owner CANON TOKKI CORP