Monitoring method and monitoring structure of wafer identification code

Abstract

The invention provides a monitoring method and a monitoring structure of a wafer identification code. The monitoring method comprises a step of providing a wafer with a peripheral region, wherein theedge of the peripheral region of the wafer has a gap, the peripheral region further comprises a wafer identification code region and a monitoring region, the monitoring region is located between the gap and the wafer identification code region, and a center line of the wafer identification code region, a center line of the monitoring region and a center line of the gap are overlapped, a step of generating the wafer identification code on a wafer of the wafer identification code region, a step of generating a monitoring identification code on the wafer of the monitoring region, wherein a centerline of the monitoring identification code and a center line of the wafer identification code are overlapped, and a step of monitoring whether the center line of the gap and the center line of the monitoring identification code are overlapped and judging whether the generated wafer identification code is offset. According to the monitoring method and the monitoring structure, whether the generated wafer identification code is offset or not can be monitored and the amount of offset of the wafer identification code can be obtained.

Description

Technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a monitoring method and a monitoring structure of a wafer identification code. Background technique [0002] With the continuous development of information technology and the widespread application of wafers, users or customers have higher and higher requirements for tracking the production, sales, and use of wafers, and they also hope that the tracking of wafers will be more and more accurate. It is not only required to be able to trace each batch of wafers produced, but also to be able to trace a single wafer. Therefore, it is imperative to switch the wafer tracking function from a batch to a more refined single wafer. [0003] In order to meet the above requirements, a wafer identification code (Wafer ID) is marked on each wafer, which serves as an identification mark of the wafer and can be used to identify each batch of wafers or even each wafer in each ...

AI Technical Summary

Problems solved by technology

[0004] However, during the process of forming the wafer identification code on the wafer, the problem of wafer identification code offset often occurs, making it difficult to identify the wafer, thereby affecting the subsequent production process

At present, Inline and OQA (Outgoing Quality Assurance) visual inspection can only check the integrity and visibility of the wafer identification code, and it is difficult to identify the positional deviation of the wafer identification code

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