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High and low temperature-resistant conductive organosilane pressure-sensitive adhesive and preparation method and application thereof

A silicone pressure sensitive adhesive, high and low temperature resistant technology, applied in the direction of conductive adhesives, pressure sensitive films/sheets, adhesives, etc. Poor performance and other problems, to achieve the effect of wide temperature range, lower installation cost, and excellent comprehensive performance

Active Publication Date: 2018-11-23
SHENZHEN NIKTO TAPE NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The temperature resistance range is narrow. Generally, the temperature range of high temperature resistant tape is -10°C.
[0006] 2. The existing heat-resistant tapes only have a single low temperature resistance or high temperature resistance, and there are few tapes that can withstand both high temperature and low temperature
[0007] 3. Due to the pursuit of temperature resistance, the existing heat-resistant tapes reduce the requirements for the performance of the adhesive, resulting in poor adhesive performance of the tape at the terminal temperature and easy degumming
[0008] 4. The conductivity of the existing conductive tape is not stable to temperature changes, and the conductivity is reduced at low temperatures

Method used

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  • High and low temperature-resistant conductive organosilane pressure-sensitive adhesive and preparation method and application thereof
  • High and low temperature-resistant conductive organosilane pressure-sensitive adhesive and preparation method and application thereof
  • High and low temperature-resistant conductive organosilane pressure-sensitive adhesive and preparation method and application thereof

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Experimental program
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Effect test

preparation example Construction

[0058] MQ resin was prepared as follows:

[0059] Step (1) In the round bottom flask (A), add the formulated amount of hexamethyldisiloxane, methylvinyldisiloxane and isopropanol, stir and raise the temperature to 65-70°C within 20 minutes.

[0060] Step (2) Add dilute sulfuric acid and sodium silicate to a flask (B) equipped with a condensing reflux pipe, a stirrer, a nitrogen protection device, a constant pressure funnel, and an air bath temperature control heating device, start stirring, and heat up to 85 Preheat at ~90°C for 15 minutes until the sodium silicate is completely dissolved.

[0061] Step (3) move the mixed solution in the flask (A) into the dropping funnel, add dropwise in the flask (B), control the drop-in time of the mixture of hexamethyldisiloxane and methylvinyldisiloxane at Between 12 and 15 minutes, maintain the reaction temperature at 115 to 120°C, and react for 1 hour.

[0062] Step (4) cool down to room temperature, extract, distill, and dry, and the...

Embodiment 1～3

[0071] The raw materials were weighed according to the proportions in Table 1, and prepared according to the steps in Example 1. The difference is that the added raw material proportions are different, and the products are prepared. See Table 1 for details:

[0072] Table 1: Raw Material Proportion Table of Embodiments 1 to 3

[0073]

[0074] In Table 1, the silicone rubber is a composition of methyl silicone rubber and phenyl silicone rubber, the weight ratio of methyl silicone rubber and phenyl silicone rubber is 1:1, and the molar fraction of silicone rubber is 12%. Viscosity 6x10 3 ~1.2x10 4 mPa·s), the crosslinking agent is 2,4-benzoyl peroxide, the condensation catalyst is dibutyltin dilaurate, the organic solvent is toluene, and the conductive filler is nickel-plated carbon fiber.

[0075] MQ resin is prepared from the following components in parts by weight: 4 parts of isopropanol, 5.5 parts of dilute sulfuric acid, 1.5 parts of hexamethyldisiloxane, 1.5 parts of...

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Abstract

The invention discloses a high and low temperature-resistant conductive organosilane pressure-sensitive adhesive and a preparation method and application thereof. The high and low temperature-resistant conductive organosilane pressure-sensitive adhesive is prepared from the following components in parts by weight: 100 parts of silicon rubber, 50 to 100 parts of silicon resin, 35 to 40 parts of conductive filler, 0.15 to 1.5 parts of condensation catalyst, 1 to 2 parts of crosslinking agent, and 20 to 30 parts of organic solvent. The high and low temperature-resistant conductive organosilane pressure-sensitive adhesive has the advantages that the temperature-resistant range is wider; the stable high stripping strength and viscosity-maintaining property can be maintained under the high temperature environment of 240 DEGC or above and the low temperature environment of -40 DEG C or below, the good conductivity can be maintained, and the higher viscosity and conductive property can be still maintained in the temperature change process; the high and low temperature-resistant conductive organosilane pressure-sensitive adhesive can be applied to the occasions requiring circuit connecting,such as installation of electronics and electric appliances, so as to reach the function of using adhering to replace welding.

Description

technical field [0001] The invention relates to the field of polymer materials, more specifically, to a high and low temperature resistant conductive silicone pressure-sensitive adhesive and its preparation method and application. Background technique [0002] Pressure sensitive adhesives are viscoelastic materials that bond instantly to most substrates and remain permanently tacky when light pressure is applied. A polymer is a pressure sensitive adhesive if it has the properties of a pressure sensitive adhesive itself or if it functions as a pressure sensitive adhesive by mixing with tackifiers, plasticizers or other additives. [0003] With the improvement of people's economic level and the development of industry, tape products are widely used in more and more fields. [0004] Existing tapes have the following disadvantages: [0005] 1. The temperature resistance range is narrow. Generally, the temperature range of high temperature resistant tape is <180°C, and the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J183/07C09J9/02C09J11/06C09J7/38
CPCC08L2205/025C08L2205/03C09J9/02C09J11/06C09J183/04C09J2483/00C09J7/38C08L83/04C08K5/14C08K7/06C08K9/02
Inventor 齐登武吴卫均
Owner SHENZHEN NIKTO TAPE NEW MATERIAL CO LTD
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