The invention discloses a high and low temperature-resistant conductive organosilane pressure-sensitive
adhesive and a preparation method and application thereof. The high and low temperature-resistant conductive organosilane pressure-sensitive
adhesive is prepared from the following components in parts by weight: 100 parts of
silicon rubber, 50 to 100 parts of
silicon resin, 35 to 40 parts of conductive filler, 0.15 to 1.5 parts of condensation catalyst, 1 to 2 parts of crosslinking agent, and 20 to 30 parts of
organic solvent. The high and low temperature-resistant conductive organosilane pressure-sensitive
adhesive has the advantages that the temperature-resistant range is wider; the stable high stripping strength and
viscosity-maintaining property can be maintained under the high temperature environment of 240 DEGC or above and the low temperature environment of -40 DEG C or below, the good
conductivity can be maintained, and the higher
viscosity and conductive property can be still maintained in the temperature change process; the high and low temperature-resistant conductive organosilane pressure-sensitive adhesive can be applied to the occasions requiring circuit connecting,such as installation of
electronics and electric appliances, so as to reach the function of using adhering to replace
welding.