Chip-positioning device and method

A positioning device and chip technology, applied in the electronic field, can solve the problem that the computing power of a single processing chip cannot meet the computing needs

Active Publication Date: 2019-01-25
SPREADTRUM COMM (SHANGHAI) CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous development of electronic technology and computer technology, the computing power of a single processing chip is getting stronger and stronger. However, in today's era, the computing power of a single processing chip is still unable to meet the growing computing needs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip-positioning device and method
  • Chip-positioning device and method
  • Chip-positioning device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0076] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0077] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

[0078] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific implementation manners. It will be understood by those skilled in the art that the present disclosure may be practiced without some of the specific details. In some instances, methods, means, componen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present disclosure relates to a chip positioning device and method. The device includes: a plurality of cascaded processing chips; a master control chip connected to the first-level processing chip of the plurality of processing chips, and is configured to judge whether an error exists in response data when receiving the response data, wherein, the response data at least comprises response check enable information, check result information, response chip identification information, response chip address information, response data information and response check code; When there is an errorin the response data, according to the identification information of the response chip and the address information of the response chip in the response data, the chip and the error address of the chipin the plurality of processing chips are determined. When the response data sent by the processing chip is incorrect, the chip positioning device can quickly identify and locate the processing chip where the error exists, and determine the error address of the processing chip where the error exists, so as to debug the processing chip where the error exists.

Description

technical field [0001] The present disclosure relates to the field of electronic technology, in particular to a chip positioning device and method. Background technique [0002] With the continuous development of electronic technology and computer technology, the computing power of a single processing chip is getting stronger and stronger. However, in today's era, the computing power of a single processing chip is still unable to meet the increasing computing needs. In related technologies, in order to meet computing requirements, multiple processing chips may be cascaded to improve computing capabilities. When an error occurs in one of the multiple cascaded processing chips, it is necessary to quickly identify the error processing chip, so as to facilitate debugging. [0003] Therefore, there is an urgent need to propose a technical solution for locating chips, so that after a problem occurs in a chip of the cascaded chip, the chip with the error can be quickly identified ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/10
CPCG06F11/1048
Inventor 唐平葛维胡均浩李振中石玲宁
Owner SPREADTRUM COMM (SHANGHAI) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap