Package structure, electronic device and package method

Abstract

The present invention provides a package structure, an electronic device and a package method. The package structure comprises a first substrate, a second substrate, a first sealant and a second sealant. The second substrate and the first substrate are oppositely arranged; the first sealant and the second sealant are arranged between the first substrate and the second substrate and allow the firstsubstrate and the second substrate to be mutually connected; the first sealant comprises a first slope far away from the first substrate; the second sealant comprises a second slope far away from thesecond substrate, and the second slope is laminated to the first slope; in the direction being in parallel to the direction of the first substrate and the second substrate, the first slope and the second slope are extended to a second position from a first position, in a direction from the first position to the second position, a distance from the first slope to the first substrate is gradually changed, and a distance from the second slope to the second substrate is gradually changed; in a range from the first position to the second position, the sum of the distance from the first slope to the first substrate and the distance from the second slope to the second substrate is basically equal. The package structure has good sealing and a long service life.

Description

technical field [0001] At least one embodiment of the present disclosure relates to a packaging structure, an electronic device, and a packaging method. Background technique [0002] Some electronic devices, such as OLED devices, are less resistant to water vapor and oxygen, and their lifespan will be reduced if exposed to water vapor or oxygen. For the packaging of electronic devices, the current packaging technology includes packaging with sealant and packaging cover plate and thin film packaging technology. Achieving good packaging effect is of great significance to improve the service life of electronic devices. Contents of the invention [0003] At least one embodiment of the present disclosure provides a packaging structure, which includes: a first substrate, a second substrate, a first sealant, and a second sealant. The second substrate is arranged opposite to the first substrate; the first sealant and the second sealant are arranged between the first substrate and...

AI Technical Summary

Problems solved by technology

[0002] Some electronic devices, such as OLED devices, are less resistant to water vapor and oxygen, and the lifetime of these electronic devices will be reduced if exposed to water vapor or oxygen

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